Search NASA⌕ Search

Engineering topics

Gyekenyesi, J. Z.

Publications and source records attributed to Gyekenyesi, J. Z..

Room Temperature Tensile Behavior and Damage Accumulation of Hi-Nicalon Reinforced SiC Matrix Composites

Composites consisting of woven Hi-Nicalon fibers, BN interphases, and different SiC matrices were studied in tension at room temperature. Composites with SiC matrices processed by CVI and melt infiltration were compared. Monotonic and load/unload/reload tensile hysteresis experiments were performed. A modal acoustic emission (AE) analyzer was used to monitor damage accumulation during the tensile test. Post test polishing of the tensile gage sections was performed to determine the extent of cracking. The occurrence and location of cracking could easily be determined using modal AE. The loss of modulus could also effectively be determined from the change in the velocity of sound across the sample. Finally, the stresses where cracks appear to intersect the load-bearing fibers correspond with high temperature low cycle fatigue run out stresses for these materials.

Morscher, G. N.↗

Nicalon/siliconoxycarbide ceramic composites

A number of polymers of differing molecular structure, viscosity, copolymer composition, and production procedures, screened for production of strong, tough Nicalon/siliconoxycarbide composites, are discussed. Variables during polymer synthesis include pH, water/methoxy ratio and phenyl/methyl ratio. Final processing temperatures of the composites range from 1200 deg to 1400 deg C. The filler is derived from pyrolysis of the 50 phenyl/50 methyl silsesquioxane copolymer pyrolyzed to 650 deg C, then milled to less than 1-micron powder. Composite samples were fractured to evaluate the influence of matrix composition, final fabrication temperature, and use of filler on the composite mode of failure, modulus, strain capability, and strength. Incorporation of filler was found to increase matrix compressive strength and to influence matrix shrinkage and cracking.

Hurwitz, F. I.↗