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Han, Kevin

Publications and source records attributed to Han, Kevin.

BIM Interoperability Tool for Improving IFC-based Model Data Exchange Between Architectural Design and Structural Analysis for Linear Piping Components

There is a growing need in the AEC industry for the digitalization of model-based data exchange in BIM workflows. However, users continue to face difficulties exchanging data between BIM-based computer-aided design (CAD) and computer-aided engineering (CAE) software, even with the open, non-proprietary data exchange format called Industry Foundation Classes (IFC). Proposed solutions in academic research focus primarily on building systems, with comparatively little attention to piping models. Therefore, this paper introduces an interoperability tool for enabling piping model data exchange between architectural and structural analysis domains. The tool is tested using a piping model created in Autodesk Revit and shows marked improvement for IFC-based CAD-to-CAE interoperability over existing practice.

97 MATHEMATICS AND COMPUTING↗

CHGNet as a pretrained universal neural network potential for charge-informed atomistic modelling

Large-scale simulations with complex electron interactions remain one of the greatest challenges for atomistic modelling. Although classical force fields often fail to describe the coupling between electronic states and ionic rearrangements, the more accurate ab initio molecular dynamics suffers from computational complexity that prevents long-time and large-scale simulations, which are essential to study technologically relevant phenomena. Here we present the Crystal Hamiltonian Graph Neural Network (CHGNet), a graph neural network-based machine-learning interatomic potential (MLIP) that models the universal potential energy surface. CHGNet is pretrained on the energies, forces, stresses and magnetic moments from the Materials Project Trajectory Dataset, which consists of over 10 years of density functional theory calculations of more than 1.5 million inorganic structures. The explicit inclusion of magnetic moments enables CHGNet to learn and accurately represent the orbital occupancy of electrons, enhancing its capability to describe both atomic and electronic degrees of freedom. We demonstrate several applications of CHGNet in solid-state materials, including charge-informed molecular dynamics in Li x MnO 2 , the finite temperature phase diagram for Li x FePO 4 and Li diffusion in garnet conductors. We highlight the significance of charge information for capturing appropriate chemistry and provide insights into ionic systems with additional electronic degrees of freedom that cannot be observed by previous MLIPs.

36 MATERIALS SCIENCE↗

Vision-based inspection of prefabricated components using camera poses: Addressing inherent limitations of image-based 3D reconstruction

Modular construction can lead to additional cost overruns and delays when a defect is found on the construction site and is not easily repairable. Researchers have developed various methods that use image-based 3D reconstruction for quality assessment, but they have inherent limitations, such as inconsistency and dealing with surfaces with reflectivity and limited visual features. Therefore, this paper presents a vision-based quality assessment method using cameras for prefabricated components by addressing these limitations. Specifically, this paper proposes a novel quality inspection method with sub-millimeter accuracy using cameras focused on leveraging camera poses (as opposed to 3D point clouds that are often not consistent in quality) from the image-based 3D reconstruction. The 3D point estimation by computing triangulation was used for achieving accurate measurement. The proposed method is validated using six different variances and two case studies – an aluminum pipe with a reflective surface and a fabricated concrete column. Furthermore, the results demonstrate the accuracy and effectiveness of the proposed method.

42 ENGINEERING↗

Automated compatibility checking of prefabricated components using 3D as-built models and BIM

There have been recent efforts to use reality capture technologies to perform remote quality control in construction. However, there is a lack of research efforts in detecting construction incompatibilities in modular construction using reality capture technologies. The construction incompatibilities in modular construction often cause reworks and delays in the project schedule. To address this issue, this paper presents a general compatibility analysis method that propose scanning the modules in manufacturing plant and construction site, and check module-to-module compatibility remotely, prior to the shipment and installation. This study provides three sample module-to-module compatibility scenarios to validate the proposed compatibility analysis. The case study results show that the compatibility analysis method was able to identify the compatibility issues with high accuracy. Lastly, the compatibility analysis method was validated in terms of accuracy and time performance in six scenarios that was defined on the modules.

42 ENGINEERING↗

Object manipulation in immersive virtual environments: Hand Motion tracking technology and snap-to-fit function

There have been recent efforts to use virtual reality and manipulation to train construction workers and inspection. However, there is a lack of research efforts comparing and evaluating virtual manipulation hardware for construction tasks. Moreover, the current practice of virtual manipulation has limited functionality to guide users with the placement of objects in virtual environments. To address these issues, this paper presents 1) a detailed case study that compares three types of manipulation hardware (image-based, infrared-based, and magnetic-based) for construction applications and 2) a snap-to-fit method that improves the VM through solving limitations of the advanced virtual reality interaction metaphors. The latter enhances the placement process for manipulation by comparing two models (e.g., scan and BIM models) for proper placement in assembly scenarios. Finally, the case study results show that magnetic-based systems outperform others in construction scenarios. Lastly, the snap-to-fit function was validated in terms of accuracy and time performance.

42 ENGINEERING↗

Bright electroluminescence in ambient conditions from WSe 2 p-n diodes using pulsed injection

Transition metal dichalcogenide (TMDC) monolayers are promising materials for next-generation nanoscale optoelectronics, including high-speed light sources and detectors. However, most past reports on TMDC light-emitting diodes are limited to operation in high vacuum, while most applications require operation under ambient conditions. Here, we study the time-resolved electroluminescence of monolayer WSe 2 p-n junctions under ambient conditions and identify the decay in current over time as the main issue preventing stable device operation. We show that pulsed voltage bias overcomes this issue and results in bright electroluminescence under ambient conditions. This is achieved in a simple single-gate structure, without the use of dual gates, heterostructures, or doping methods. Internal quantum efficiency of electroluminescence reaches ~1%, close to the photoluminescence quantum efficiency, indicating efficient exciton formation with injected carriers. Emission intensity is stable over hours of device operation. Finally, our device exhibits ~15 ns rise and fall times, the fastest direct modulation speed reported for TMDC light-emitting diodes.

2D materials↗

Large-area and bright pulsed electroluminescence in monolayer semiconductors

Transition-metal dichalcogenide monolayers have naturally terminated surfaces and can exhibit a near-unity photoluminescence quantum yield in the presence of suitable defect passivation. To date, steady-state monolayer light-emitting devices suffer from Schottky contacts or require complex heterostructures. Here, we demonstrate a transient-mode electroluminescent device based on transition-metal dichalcogenide monolayers (MoS 2 , WS 2 , MoSe 2 , and WSe 2 ) to overcome these problems. Electroluminescence from this dopant-free two-terminal device is obtained by applying an AC voltage between the gate and the semiconductor. Notably, the electroluminescence intensity is weakly dependent on the Schottky barrier height or polarity of the contact. We fabricate a monolayer seven-segment display and achieve the first transparent and bright millimeter-scale light-emitting monolayer semiconductor device.

36 MATERIALS SCIENCE↗