Hartenstine, John | Search NASA

NASA NTRS2014

Low-Cost Radiator for Fission Power Thermal Control

NASA Glenn Research Center (GRC) is developing fission power system technology for future Lunar surface power applications. The systems are envisioned in the 10 to 100kW(sub e) range and have an anticipated design life of 8 to 15 years with no maintenance. NASA GRC is currently setting up a 55 kW(sub e) non-nuclear system ground test in thermal-vacuum to validate technologies required to transfer reactor heat, convert the heat into electricity, reject waste heat, process the electrical output, and demonstrate overall system performance. Reducing the radiator mass, size, and cost is essential to the success of the program. To meet these goals, Advanced Cooling Technologies, Inc. (ACT) and Vanguard Space Technologies, Inc. (VST) are developing a single facesheet radiator with heat pipes directly bonded to the facesheet. The facesheet material is a graphite fiber reinforced composite (GFRC) and the heat pipes are titanium/water. By directly bonding a single facesheet to the heat pipes, several heavy and expensive components can be eliminated from the traditional radiator design such as, POC(TradeMark) foam saddles, aluminum honeycomb, and a second facesheet. A two-heat pipe radiator prototype, based on the single facesheet direct-bond concept, was fabricated and tested to verify the ability of the direct-bond joint to withstand coefficient of thermal expansion (CTE) induced stresses during thermal cycling. The thermal gradients along the bonds were measured before and after thermal cycle tests to determine if the performance degraded. Overall, the results indicated that the initial uniformity of the adhesive was poor along one of the heat pipes. However, both direct bond joints showed no measureable amount of degradation after being thermally cycled at both moderate and aggressive conditions.

Bonding↗

NASA NTRS2012

Loop Heat Pipe with Thermal Control Valve as a Variable Thermal Link

Future lunar landers and rovers will require variable thermal links that allow for heat rejection during the lunar daytime and passively prevent heat rejection during the lunar night. During the lunar day, the thermal management system must reject the waste heat from the electronics and batteries to maintain them below the maximum acceptable temperature. During the lunar night, the heat rejection system must either be shut down or significant amounts of guard heat must be added to keep the electronics and batteries above the minimum acceptable temperature. Since guard heater power is unfavorable because it adds to system size and complexity, a variable thermal link is preferred to limit heat removal from the electronics and batteries during the long lunar night. Conventional loop heat pipes (LHPs) can provide the required variable thermal conductance, but they still consume electrical power to shut down the heat transfer. This innovation adds a thermal control valve (TCV) and a bypass line to a conventional LHP that proportionally allows vapor to flow back into the compensation chamber of the LHP. The addition of this valve can achieve completely passive thermal control of the LHP, eliminating the need for guard heaters and complex controls.

Hartenstine, John↗