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Hatfield, Kendrich O'Donaghue

Publications and source records attributed to Hatfield, Kendrich O'Donaghue.

Tungsten Electrodeposition

Tungsten is a refractory metal with a very high melting point (3422 °C), hardness (7.5 on Mohs hardness scale), and chemical resistance, making it useful in applications with extreme conditions. Electrodeposition is an attractive technique for coating metals because of its scalability and applicability to objects of intricate shape, though tungsten electrodeposition remains difficult. Some multi-step methods first coat either a sacrificial metal such as zinc or a layer of tungsten oxide which is then converted to metallic tungsten with WCl6 immersion (i.e. a redox replacement reaction) or heating in a reducing atmosphere, respectively. Single step deposition would save time and money, making it more viable on an industrial scale. Most reports detailing direct tungsten electrodeposition use molten salts which are energy intensive, hazardous, and difficult to maintain. Few reports have demonstrated single-step, low temperature electrodeposition deposition of tungsten in atmosphere. An article from 1931 reports successful metal tungsten electrodeposition from a highly basic sodium tungstate solution, though the authors reported very low current efficiency (<1%) and required heating to 80+ °C to obtain metallic films. This report outlines our attempts to electroplate tungsten from various solutions on different electrode materials, none of which succeeded. Our intent is to guide future researchers at Los Alamos National Laboratory that would attempt tungsten electrodeposition.

36 MATERIALS SCIENCE↗

Electrodeposition and analysis of thick bismuth films

Due to its unique physical and chemical properties, bismuth is an attractive candidate for a wide range of applications such as battery anodes, radiation shielding, and semiconductors, to name a few. This work presents the electrodeposition of mechanically stable and homogenous bismuth films at micron-scale thicknesses. A simple one-step electrodeposition process using either a pulse/reverse or direct current source yielded thick, homogenous, and mechanically stable bismuth films. Morphology, electrochemical behavior, adhesion, and mechanical stability of bismuth coatings plated with varying parameters were characterized via optical profilometry, cyclic voltammetry, electron microscopy, and tribology. Scratch testing on thick electroplated coatings (> 100 µm) revealed similar wear resistance properties between the pulse/reverse plated and direct current electroplated films. This study presents a versatile bismuth electroplating process with the possibility to replace lead in radiation shields with an inexpensive, non-toxic metal, or to make industrially relevant electrocatalytic devices.

37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗