Engineering topics

Heim, T.

Publications and source records attributed to Heim, T..

3 records

DOE OSTI2023

Production and testing of the powerboard for ATLAS ITk Strip barrel modules

The upgrade of the ATLAS ITk strips detector for HL-LHC will employ a custom PCB (powerboard) for on-module DC-DC conversion, HV switching, and monitoring. Production of about 14100 of such PCBs with high reliability is a big challenge. In this paper we will present the production procedure and quality control (QC) testing system for the powerboards to be installed on ITk Strip barrel modules. During production, about 150 powerboards will be produced every week. Each powerboard will need to pass QC tests before they are assembled to module. The QC tests include thermal cycling between -35 °C and 40 °C, soak test (continuous running of DC-DC converter at high load at 20 °C), and basic functionality and characterization electrical tests of the low voltage (LV), high voltage (HV), and monitoring functions of the powerboard. A custom QC test system is described, which is based on a reusable PCB (active board) with all testing circuits, a one-time powerboard carrier card, and a Z-turn SoC board which hosts and runs the testing program. The production procedure and QC test system has been tested with 400 powerboards during pre-production, and the system has been proven ready for production with the desired testing program, speed, safety, and cost. Performance and typical failures of powerboards observed during the QC test of pre-production powerboards is also presented.

47 OTHER INSTRUMENTATION↗

DOE OSTI2021

Magnetic triggering — time-resolved characterisation of silicon strip modules in the presence of switching DC-DC converters

Modules for the ATLAS Inner Tracker (ITk) strip tracker include a DC-DC converter circuit glued directly to the silicon sensor which converts the 11 V supplied to the module to the 1.5 V required for the operation of the readout chips. The DC-DC converter unit, consisting of a copper solenoid and custom ASIC, is located directly above the silicon strip sensor and therefore needs to be shielded to protect the sensor from EMI noise created during the operation of the circuit. Despite dedicated shielding, consisting of an aluminium shield box with continuous solder seams encompassing the surface components and a copper layer in the PCB beneath it, module channels connected to sensor strips located beneath the converter circuit were found to show a noise increase. While the DC-DC converter unit causing the underlying EMI noise operates at a frequency of 2 MHz, module characterisation measurements for ITk strip tracker modules are typically performed asynchronously to the DC-DC switching and are therefore averaged over the full range of time bins with respect to the converter frequency. In order to investigate the time dependence of the noise injection relative to the DC-DC switching frequency, a dedicated setup to understand the time-resolved performance change in modules was developed. By using a magnetic field probe to measure the field leaking through the shield box and triggering on its rising edge, data taking could be synchronised with the DC-DC switching. This paper illustrates the concept and setup of such time-resolved performance measurements using magnetic triggering and presents results for the observed effects on signal and noise for ATLAS ITk strip modules from both laboratory and beam tests.

47 OTHER INSTRUMENTATION↗

DOE OSTI2020

The ABC130 barrel module prototyping programme for the ATLAS strip tracker

For the Phase-II Upgrade of the ATLAS Detector [1], its Inner Detector, consisting of silicon pixel, silicon strip and transition radiation sub-detectors, will be replaced with an all new 100% silicon tracker, composed of a pixel tracker at inner radii and a strip tracker at outer radii. The future ATLAS strip tracker will include 11,000 silicon sensor modules in the central region (barrel) and 7,000 modules in the forward region (end-caps), which are foreseen to be constructed over a period of 3.5 years. The construction of each module consists of a series of assembly and quality control steps, which were engineered to be identical for all production sites. In order to develop the tooling and procedures for assembly and testing of these modules, two series of major prototyping programs were conducted: an early program using readout chips designed using a 250 nm fabrication process (ABCN-250) [2,2] and a subsequent program using a follow-up chip set made using 130 nm processing (ABC130 and HCC130 chips). This second generation of readout chips was used for an extensive prototyping program that produced around 100 barrel-type modules and contributed significantly to the development of the final module layout. This paper gives an overview of the components used in ABC130 barrel modules, their assembly procedure and findings resulting from their tests.

47 OTHER INSTRUMENTATION↗