High Density Microbump Development for Multi-Project Wafer (MPW) Die.
Abstract not provided.
Jordan, Matthew↗
Engineering topics
Hollowell, Andrew E
Publications and source records attributed to Hollowell, Andrew E.
Advancing Compound Semiconductors Through Heterogeneous Integration.
Abstract not provided.
Douglas, Erica Ann↗
Heterogeneous Integration of Silicon Electronics and Compound Semiconductor Optoelectronics for Miniature RF Photonic Transceivers.
Abstract not provided.
Nordquist, Christopher↗
Cu ECD in High Aspect Ratio Mesoscale TSVs: Scaling from Die Level to Wafer Level Plating.
Abstract not provided.
Schmitt, Rebecca P.↗
Heterogeneous Integration of Silicon Electronics and Compound Semiconductor Optoelectronics for Miniature RF Photonic Transceivers.
Abstract not provided.
Nordquist, Christopher↗
Copper Electrodeposition in High Aspect Ratio Mesoscale Through-Silicon Vias: Scaling from Die Level to Wafer Level Plating.
Abstract not provided.
Schmitt, Rebecca P.↗
Heterogeneous Integration of 3D Photonic Integrated Circuits.
Abstract not provided.
McClain, Jaime L.↗