Search NASA⌕ Search

Engineering topics

Holtze, R. F.

Publications and source records attributed to Holtze, R. F..

Integral assembly of photovoltaic arrays using glass

For a number of reasons glass is an excellent material for encapsulation of solar cell arrays. Glass can be readily available at relatively low cost. It exhibits excellent stability against degradation by solar ultraviolet illumination and atmospheric pollutants. A superior approach results if glass is employed directly as an integral encapsulant without secondary organic materials. A description is presented of a electrostatic bonding process which is being developed for integral assembly of glass encapsulated arrays. Solar cells are placed in contact with the glass surface, temperature is raised until the glass becomes ionically conductive, and an electric field is applied to initiate the bonding action. Silicon solar cells up to 3 inches in diameter have been integrally bonded without degradation.

Younger, P. R.↗

Terrestrial solar arrays with integral glass construction

An excellent encapsulation system for a terrestrial solar array can be formed using two sheets of glass. Superior technical character, very low cost and simple assembly can result if the active components and the glass sheets are integrally bonded together such that the array is hermetically sealed without employing organic encapsulation materials. Such an approach is being developed using electrostatic bonding. Status of this development is described. Functioning integral glass test modules have been fabricated and subjected to environmental testing. Results have been excellent.

Younger, P. R.↗

Properties of conductive thick-film inks

Ten different conductive inks used in the fabrication of thick-film circuits were evaluated for their physical and handling properties. Viscosity, solid contents, and spectrographic analysis of the unfired inks were determined. Inks were screened on ceramic substrates and fired for varying times at specified temperatures. Selected substrates were given additional firings to simulate the heat exposure received if thick-film resistors were to be added to the same substrate. Data are presented covering the (1) printing characteristics, (2) solderability using Sn-63 and also a 4 percent silver solder, (3) leach resistance, (4) solder adhesion, and (5) wire bonding properties. Results obtained using different firing schedules were compared. A comparison was made between the various inks showing general results obtained for each ink. The changes in firing time or the application of a simulated resistor firing had little effect on the properties of most inks.

Holtze, R. F.↗