Cross-Axis Flexural Pivots in Mechatronic Applications: Stress-Based Design for Combined Tension and Bending
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Peterson, Brandon T.↗
Engineering topics
Hopkins, Jonathan B.
Publications and source records attributed to Hopkins, Jonathan B..
Compliant Intramedullary Stems for Joint Reconstruction
The longevity of current joint replacements is limited by aseptic loosening, which is the primary cause of non-infectious failure for hip, knee, and ankle arthroplasty. Aseptic loosening is typically caused either by osteolysis from particulate wear, or by high shear stresses at the bone-implant interface from over-constraint. Our objective was to demonstrate feasibility of a compliant intramedullary stem that eliminates over-constraint without generating particulate wear. The compliant stem is built around a compliant mechanism that permits rotation about a single axis. We first established several models to understand the relationship between mechanism geometry and implant performance under a given angular displacement and compressive load. We then used a neural network to identify a design space of geometries that would support an expected 100-year fatigue life inside the body. We additively manufactured one representative mechanism for each of three anatomic locations, and evaluated these prototypes on a KR-210 robot. The neural network predicts maximum stress and torsional stiffness with 2.69% and 4.08% error respectively, relative to finite element analysis data. We identified feasible design spaces for all three of the anatomic locations. Simulated peak stresses for the three stem prototypes were below the fatigue limit. Benchtop performance of all three prototypes was within design specifications. Our results demonstrate the feasibility of designing patient- and joint-specific compliant stems that address the root causes of aseptic loosening. Guided by these results, we expect the use of compliant intramedullary stems in joint reconstruction technology to increase implant lifetime.
60 APPLIED LIFE SCIENCES↗
Combining cross-pivot flexures to generate improved kinematically equivalent flexure systems
In this work, we show that new kinematic equivalents with improved performance of standard flexure elements can be systematically synthesized by combination of cross-pivot flexures. Cross-pivot flexures provide a unique feature of kinematic stability under both high loading and large displacement conditions which can be exploited to synthesize a range of kinematic equivalents to standard flexure elements which retain much greater stiffness, load capacity and range capacity than the traditional elements. Cross-pivot synthetic elements provide a means to expand the performance of a large range of flexure-based structures including motion stages, manufacturing equipment and optical systems. This could result in better data collection, smaller systems, and less distortion in operation.
42 ENGINEERING↗
Current challenges and potential directions towards precision microscale additive manufacturing – Part III: Energy induced deposition and hybrid electrochemical processes
The Part III of the four-part series of articles discusses the challenges and opportunities in microscale additive manufacturing processes, specifically focusing on energy-induced deposition and electrochemical processes. Compared to the direct ink write (DIW) and laser-based processes, the energy-induced deposition methods can fabricate high-resolution, high aspect ratio and complex parts, while the hybrid electrochemical process can be used to fabricate complex parts using a wide range of conductive and photoactive materials. However, the volumetric throughput of these processes is lower than their DIW and laser-based counterparts. The processes that have been explored in this process are Focused-ion Beam Induced Deposition (FIBID), Laser Chemical Vapor Deposition (LCVD), Menicus-confined Electrodeposition (MCED) and Laser-Enabled Electrochemical Printing (LECP). The range of processable materials, feature-size resolution, geometry and volumetric throughput are used as factors to evaluate the current state-of-the-art for these processes. Finally, novel approaches have been proposed in the article to address these challenges associated with microscale AM processes.
42 ENGINEERING↗