Hossein-Zadeh, Mani | Search NASA

NASA NTRS2007

R.F Microphotonics for NASA Space Communications Applications

An RF microphotonic receiver has-been developed at Ka-band. The receiver consists of a lithium niobate micro-disk that enables RF-optical coupling to occur. The modulated optical signal (- 200 THz) is detected by the high-speed photonic signal processing electronics. When compared with an electronic approach, the microphotonic receiver technology offers 10 times smaller volume, smaller weight, and smaller power consumption; greater sensitivity; and optical isolation for use in extreme environments. The status of the technology development will be summarized, and the potential application of the receiver to NASA space communications systems will be described.

Pouch, John↗

NASA NTRS2003

Packaging Considerations for Integrated RF Microphotonic Receiver at Ka-Band

The NASA Computing, Information and Communications Technology (CICT) Program is supporting the development of an RF microphotonic Ka-band receiver. The receiver consists of a lithium niobate micro-disk that enables the incoming RF signal (up to Ka-band) to be coupled to the optical signal (approx. 200 THz). The modulated optical signal is detected by the high-speed photonic signal processing electronics. When compared with an all-electronic approach, the microphotonic receiver technology offers 1 Ox smaller volume, smaller weight, and smaller power consumption, greater sensitivity, and optical isolation for applications in extreme environments. It could potentially be implemented to support planetary surface-to-surface and surface-to-relay communications, as well as high-data-rate inter-satellite links. We are currently studying a number of fabrication and integration issues that could result as this technology is advanced for potential insertion into a NASA mission. The results of our preliminary effort to integrate the RF microphotonic receiver components (e.g., the lithium niobate micro-disk, the optical elements, and the Ka-band patch antenna) on an etched silicon wafer will be presented, In addition, the concomitant integration and packaging issues, and the potential NASA applications will be discussed.

Nguyen, Hung↗