Strain-Rate Dependence of the Martensitic Transformation Behavior in a 10 Pct Ni Multi-phase Steel Under Compression
Abstract not provided
Engineering topics
Publications and source records attributed to Hufnagel, T. C..
Abstract not provided
Dynamic point impact loading is a primary cause of fracture of glass screens on mobile devices. An improved understanding of crack initiation and evolution under high-speed indentation could contribute to the development of materials with better performance, but experimental observations are challenging due to the short timescales and limited depth-of-field of optical microscopy. To address this need, we have observed fracture of a chemically-strengthened glass during dynamic indentation using in situ x-ray phase-contrast imaging (XPCI). Median cracks initiate below the surface of the glass, at a depth approximately corresponding to the depth at which the surface residual compressive stress diminishes to zero. These cracks initially propagate at ~10ms –1 , rapidly accelerating to > 100ms –1 . We also observe some evidence for rate-dependent behavior, in that indentation at the lowest rates studied here (below about ~0.15ms –1 ) fails to initiate cracks regardless of the depth of the indentation (up to 18μm), while indentation at higher rates produces median cracks that either arrest or cause complete fracture, depending on the depth of indentation.
Not Available
Abstract not provided
Here, we demonstrate the use of X-ray phase contrast imaging with sub-microsecond temporal resolution to obtain quantitative visualization of dynamic fracture processes in brittle solids. We examine an amorphous solid (fused silica), a ceramic single crystal (single-crystal quartz), and a polycrystalline ceramic (boron carbide), in the form of single-edge notched specimens loaded using a three-point apparatus at nominal strain rates up to ~800 s -1 . We observe that the crack tip speed for boron carbide is relatively independent of mode I stress intensity factor rate ($\dot{K}$ I ) for these rates of loading, while that of fused silica and single-crystal quartz increases with $\dot{K}$ I . Further, for the amorphous and single crystal cases, we observe the development of a crack tip instability in the form of crack branching as the crack tip speed approaches 45% of the Rayleigh wave speed. This suggests that strain-rate-dependent mechanisms contribute to crack branching. Such mechanisms may, in turn, affect the macroscopic fracture properties of these materials.
A technique for measuring interdiffusion in multilayer materials during rapid heating using X-ray reflectivity is described. In this technique the sample is bent to achieve a range of incident angles simultaneously, and the scattered intensity is recorded on a fast high-dynamic-range mixed-mode pixel array detector. Heating of the multilayer is achieved by electrical resistive heating of the silicon substrate, monitored by an infrared pyrometer. As an example, reflectivity data from Al/Ni heated at rates up to 200 K s -1 are presented. At short times the interdiffusion coefficient can be determined from the rate of decay of the reflectivity peaks, and it is shown that the activation energy for interdiffusion is consistent with a grain boundary diffusion mechanism. At longer times the simple analysis no longer applies because the evolution of the reflectivity pattern is complicated by other processes, such as nucleation and growth of intermetallic phases.
We have developed two techniques for time-resolved x-ray diffraction from bulk polycrystalline materials during dynamic loading. In the first technique, we synchronize a fast detector with loading of samples at strain rates of ∼10{sup 3}–10{sup 4} s{sup −1} in a compression Kolsky bar (split Hopkinson pressure bar) apparatus to obtain in situ diffraction patterns with exposures as short as 70 ns. This approach employs moderate x-ray energies (10–20 keV) and is well suited to weakly absorbing materials such as magnesium alloys. The second technique is useful for more strongly absorbing materials, and uses high-energy x-rays (86 keV) and a fast shutter synchronized with the Kolsky bar to produce short (∼40 μs) pulses timed with the arrival of the strain pulse at the specimen, recording the diffraction pattern on a large-format amorphous silicon detector. For both techniques we present sample data demonstrating the ability of these techniques to characterize elastic strains and polycrystalline texture as a function of time during high-rate deformation.