Engineering topics

Kallas, M. N.

Publications and source records attributed to Kallas, M. N..

3 records

NASA NTRS1993

On 'large-scale' stable fiber displacement during interfacial failure in metal matrix composites

Experimental results are presented to show that interfacial failure in sapphire-reinforced niobium is characterized by 'large-scale' (5-15 microns) plasticity-controlled fiber displacements occurring under increasing loads. The results are based on the responses during thin-slice fiber pushout tests wherein the fiber is supported over a hole twice the fiber diameter. The results describe an interfacial failure process that should also occur near fiber ends during pullout when a fiber is well-bonded to a soft, ductile matrix, such that eventual failure occurs by shear within the matrix near the interface.

Petrich, R. R.↗

NASA NTRS1993

Fiber pushout and interfacial shear in metal-matrix composites

Recent thin-slice pushout tests have suggested that MMC matrix-fiber interface failure processes depend not only on such intrinsic factors as bond strength and toughness, and matrix plasticity, but such extrinsic factors as specimen configuration, thermally-induced residual stresses, and the mechanics associated with a given test. After detailing the contrasts in fiber-pullout and fiber-pushout mechanics, attention is given to selected aspects of thin-slice fiber pushout behavior illustrative of the physical nature of interfacial shear response and its dependence on both intrinsic and extrinsic factors.

Koss, Donald A.↗

NASA NTRS1992

Interfacial stress state present in a 'thin-slice' fibre push-out test

An analysis of the stress distributions along the fiber-matrix interface in a 'thin-slice' fiber push-out test is presented for selected test geometries. For the small specimen thicknesses often required to displace large-diameter fibers with high interfacial shear strengths, finite element analysis indicates that large bending stresses may be present. The magnitude of these stresses and their spatial distribution can be very sensitive to the test configuration. For certain test geometries, the specimen configuration itself may alter the interfacial failure process from one which initiates due to a maximum in shear stress near the top surface adjacent to the indentor, to one which involves mixed mode crack growth up from the bottom surface and/or yielding within the matrix near the interface.

Kallas, M. N.↗