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Kapcio, Paul

Publications and source records attributed to Kapcio, Paul.

BAE Systems Radiation Hardened SpaceWire ASIC and Roadmap

An Application Specific Integrated Circuit (ASIC) that implements the SpaceWire protocol has been developed in a radiation hardened 0.25 micron CMOS, technology. This effort began in March 2003 as a joint development between the NASA Goddard Space Flight Center (GSFC) and BAE Systems. The BAE Systems SpaceWire ASlC is comprised entirely of reusable core elements, many of which are already flight-proven. It incorporates a 4-port SpaceWire router with two local ports, dual PC1 bus interfaces, a microcontroller, 32KB of internal memory, -and a memory controller for additional external memory use. The SpaceWire ASlC is planned for use on both the Geostationary Operational Environmental Satellites (GOES)-R and the Lunar Reconnaissance Orbiter (LRO). Engineering parts have already been delivered to both programs. This paper discusses the SpaceWire protocol and those elements of it that have been built into the current SpaceWire reusable core. There are features within the core that go beyond the current standard that can be enabled or disabled by the user and these will be described. The adaptation of SpaceWire to BAE Systems' On Chip Bus (OCB) for compatibility with the other reusable cores will be discussed. Optional configurations within user systems will be shown. The physical imp!ementation of the design will be described and test results from the hardware will be discussed. Finally, the BAE Systems roadmap for SpaceWire developments will be discussed, including some products already in design as well as longer term plans.

Berger, Richard↗

NASA/BAE SYSTEMS SpaceWire Effort

This paper discusses the state of the NASA and BAE SYSTEMS developments of SpaceWire. NASA has developed intellectual property that implements SpaceWire in Register Transfer Level (RTL) VHDL for a SpaceWire link and router. This design has been extensively verified using directed tests from the SpaceWire Standard and design specification, as well as being randomly tested to flush out hard to find bugs in the code. The high level features of the design will be discussed, including the support for multiple time code masters, which will be useful for the James Webb Space Telescope electrical architecture. This design is now ready to be targeted to FPGA's and ASICs. Target utilization and performance information will be presented for Spaceflight worthy FPGA's and a discussion of the ASIC implementations will be addressed. In particular, the BAE SYSTEMS ASIC will be highlighted which will be implemented on their .25micron rad-hard line. The chip will implement a 4-port router with the ability to tie chips together to make larger routers without external glue logic. This part will have integrated LVDS drivers/receivers, include a PLL and include skew control logic. It will be targeted to run at greater than 300 MHz and include the implementation for the proposed SpaceWire transport layer. The need to provide a reliable transport mechanism for SpaceWire has been identified by both NASA And ESA, who are attempting to define a transport layer standard that utilizes a low overhead, low latency connection oriented approach that works end-to-end. This layer needs to be implemented in hardware to prevent bottlenecks.

Rakow, Glenn Parker↗

NASA/BAE Systems SpaceWire Efforts

This paper discusses the state of the NASA and BAE SYSTEMS developments using Spacewire. NASA has developed intellectual property that implements Spacewire in Register Transfer Level VHDL for a Spacewire link and router. This design has been extensively verified using directed tests from the Spacewire Standard and design specification, as well as being randomly tested to flush out hard to find bugs in the code. The high level features of the design will be discussed, including the support for multiple time code masters, which will be useful for the James Webb Space Telescope electrical architecture. This design is now ready to be targeted to FPGA's and ASICs. Target utilization and performance information will be presented for some spaceflight qualified FPGA's and a discussion of the ASIC implementations will be addressed. In particular, the BAE SYSTEMS ASIC will be highlighted which will be implemented in their 0.25 micron rad-hard line. The chip will implement a 4-port router with the ability to tie chips together to make larger routers without external glue logic. This part will have integrated LVDS driver/receivers, include a PLL and include skew control logic. It will be targeted to run at greater than 300 MHz and include the implementation for the proposed Spacewire transport layer. The need to provide a reliable transport mechanism for Spacewire has been identified by both NASA and ESA, who are attempting to define a transport layer standard that utilizes a low overhead, low latency connection oriented approach. The Transport layer needs to be implemented in hardware-to prevent bottlenecks.

Rakow, Glenn Parker↗