Engineering topics
Publications and source records attributed to Katzin, L..
Integrated circuit modules can be compactly assembled into short-run complex electronic assemblies by mounting them on a Stick module. This module provides a method of high-density packaging for industrial operations that require the fabrication of compact circuitry configurations.
One-shot, breakaway multiwire cable connector is fabricated by using a number of small-diameter interconnecting wires, each of which, differing incrementally in length, is welded to neighboring pin and cable terminations. This design eliminates frictional binding and provides highly reliable cable interconnections until the connector is disengaged.
Flat pack interconnection structure composed of stick modules simplifies modular electronic assemblies by allowing a single axis mother board. Two of the wiring planes are located in the stick module, which is the lower level of assembly, with the third wiring plane in the mother board.
Packaging methods for electronic components encased in flat pack geometries, and spacecraft applications of proposed methods
Study of design approaches that are taken toward optimizing the packaging of electronic modules with respect to size, shape, component orientation, interconnections, and structural support. The study does not present a solution to specific packaging problems, but rather the factors to be considered to achieve optimum packaging designs.
Stick module interconnection of flat packs into single-axis motherboard