Engineering topics
Publications and source records attributed to Keir, A. R..
New tool enters narrow gap between fragile materials and removes adhesively bonded filler without damage to adjacent surfaces. Reaches deep into narrow crevices to reach hidden bond lines. Tool originally developed to remove ceramic filler from between Space Shuttle surface-insulation tiles.
Simple tool makes accurate square cuts through strips of woven or felted materials, such as high temperature aramid fabric. Pressing handle on Guillotine Cutter forces razor blade through strip of material in slot, cutting strip off squarely.
Hand-held tool measures small gaps between tiles rapidly and accurately, even when gap is tapered or indented below surface. Tool indicates gap dimensions on calibrated disk. Measurements are accurate within plus or minus 0.003 inch. Tool was developed for determining gap between tiles on Space Shuttle, but may be of use in other applications requiring precise setting of gaps between tiles or other structures.
Bench-mounted and hand-held laser units cut insulation from wires without nipping or scraping conductor. Process eliminates quality control problems and is fast, clean, precise, and repeatable.
Probe located on outer wall of vacuum-jacketed fluid lines detects leaks on inner wall. Probe picks up and amplifies vibrations that occur when gas rushes through leak and converts them to audible signal or CRT display. System is considerably simpler to use than helium leak detectors and allows rapid checks to be made as part of routine maintenance.
Tool powered by pressurized water or air removes water soluble plaster lining from Kevlar/epoxy duct. Rotating plastic cutterhead with sealed end fitting connects flexible shaft that allows tool to be used with curved ducts.
Semi-automatic-wire labeling equipment installs heat-shrink identification sleeves on small-diameter wires for moderate-size production runs. Supply reel contains wire of desired diameter and is cut into lengths set on the measuring rolls. Required number of identification sleeves are slipped over wire, which is then placed through sleeve-releasing mechanism. Sleeves are shrunk at 350 degrees F in an infrared oven.
Inexpensive kit improves bond quality, saves time, and is used in hard-to-reach areas. Kit provides precise pressure loading, and allows pressure to be monitored during curing cycle.