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Kempf, Nicholas

Publications and source records attributed to Kempf, Nicholas.

High-throughput printing of combinatorial materials from aerosols

The development of new materials and their compositional and microstructural optimization are essential in regard to next-generation technologies such as clean energy and environmental sustainability. However, materials discovery and optimization have been a frustratingly slow process. The Edisonian trial-and-error process is time consuming and resource inefficient, particularly when contrasted with vast materials design spaces 1 . Whereas traditional combinatorial deposition methods can generate material libraries 2,3 , these suffer from limited material options and inability to leverage major breakthroughs in nanomaterial synthesis. Here we report a high-throughput combinatorial printing method capable of fabricating materials with compositional gradients at microscale spatial resolution. In situ mixing and printing in the aerosol phase allows instantaneous tuning of the mixing ratio of a broad range of materials on the fly, which is an important feature unobtainable in conventional multimaterials printing using feedstocks in liquid–liquid or solid–solid phases 4–6 . We demonstrate a variety of high-throughput printing strategies and applications in combinatorial doping, functional grading and chemical reaction, enabling materials exploration of doped chalcogenides and compositionally graded materials with gradient properties. The ability to combine the top-down design freedom of additive manufacturing with bottom-up control over local material compositions promises the development of compositionally complex materials inaccessible via conventional manufacturing approaches.

36 MATERIALS SCIENCE↗

Thermoelectric power generation in the core of a nuclear reactor

Thermoelectric energy converters offer a promising solution to generate electrical power using heat in the nuclear reactor core. Despite significant improvements in thermoelectric efficiency of nanostructured materials, the performance of these advanced materials has yet to be demonstrated in the harsh radiation environment of a reactor core. Herein, we demonstrate a thermoelectric generator (TEG) made from nanostructured bulk half-Heusler (HH) materials generating stable electrical power density > 1140 W/m 2 after 30 days in the MIT Nuclear Research Reactor under an unprecedented fast-neutron (>1 MeV) fluence of 1.5 × 10 20 n/cm 2 . Despite an initial degradation due to irradiation damage when operating under relatively low temperatures, our TEG showed a 20-fold increase in power output when operating under high temperature due to in-situ annealing and resulting thermoelectric property recovery. First-principles modeling indicates that a chemically disordered metallic phase was formed under irradiation at lower temperatures, resulting in a drastic degradation in thermoelectric properties, while at sufficiently high temperatures the system returned to the initial chemically ordered HH phase and the thermoelectric properties recovered. Transmission electron microscopy and electron diffraction demonstrated that the chemically disordered phase was formed upon ion irradiation, confirming the prediction from first-principles simulations. Furthermore, the results suggest that with proper control over the TEG operating temperatures, the nanostructured bulk TEGs could produce stable electrical power and operate indefinitely in the core of a nuclear reactor.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗

Aerosol jet printed 3 omega sensors for thermal conductivity measurement

The 3 omega (3ω) method is a trusted technique for measuring thermal conductivity—a fundamental material property of critical importance in a broad range of applications. However, traditional 3ω sensor processing requires some form of physical vapor deposition, such as metal evaporation or sputtering. These 3ω sensor deposition techniques limit the materials and sample sizes applicable to the 3ω method. This work demonstrates an aerosol jet printing method to directly print silver 3ω sensors that yield accurate temperature-dependent measurement up to 300 °C on materials with thermal conductivity ranging from 1 to 150 W/m K. The interrelationship between printed sensor geometry, sensor thermal stability, and applicability to the 3ω method is examined. Thermal conductivity measurement with 3ω sensors conventionally sintered at 300 °C agrees to independent laser flash measurement within 4% from room temperature to 150 °C. An unconventional rapid high-temperature sintering method is shown to produce sensors that agree within 3% of the laser flash measurements from room temperature to 300 °C. The rapid sintering profiles also reduced the sensor–substrate thermal boundary resistance of the printed sensors by as much as 88%. The direct printing of 3ω sensors creates opportunities for measurement of thermal transport properties in applications previously inapplicable to the 3ω method.

47 OTHER INSTRUMENTATION↗

A robust high sensitivity scanning thermal probe for simultaneous microscale thermal and thermoelectric property mapping

Scanning Thermal Microscopy (SThM) provides efficient thermal property measurement with micro- or nanoscale spatial resolution. However, the sensitivity and accuracy of state-of-the-art thermal probes have been limited by excessive thermal contact resistance between the probe and sample. Introduced herein is a robust thermal microprobe that can increase the probe-sample contact force by more than two orders of magnitude, thereby reducing the probe-sample thermal contact resistance by as much as 96% and increasing measurement sensitivity by more than 240% compared to a commercial thermal probe with the same dimensions and measurement principle. The relationship between the probe-sample thermal contact resistance, thermal exchange radius, and sample thermal conductivity is determined experimentally. Simultaneous measurement of thermal conductivity and Seebeck coefficient with unprecedented sensitivity is demonstrated using the enhanced scanning thermal microprobe on samples of an extended range of thermal conductivity up to 18 W/m K, increasing the range of samples applicable to SThM when compared to the conventional commercial probe with diminished measurement sensitivity above ~10 W/m K. The probe is further demonstrated by simultaneously mapping thermal conductivity and Seebeck coefficient as a function of depth from the irradiated surface of an ion-irradiated bulk nanostructured thermoelectric material. In addition to enabling microscale thermal conductivity and Seebeck coefficient measurement of materials previously not applicable to SThM, the probe can also facilitate high-throughput characterization of combinatorial materials to aid the rapid discovery of compositions and processing conditions that yield highly desired thermal and thermoelectric properties.

36 MATERIALS SCIENCE↗