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Kenney, C

Publications and source records attributed to Kenney, C.

7 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2014

Planning the Future of U.S. Particle Physics (Snowmass 2013): Chapter 8: Instrumentation Frontier

These reports present the results of the 2013 Community Summer Study of the APS Division of Particles and Fields ("Snowmass 2013") on the future program of particle physics in the U.S. Chapter 8, on the Instrumentation Frontier, discusses the instrumentation needs of future experiments in the Energy, Intensity, and Cosmic Frontiers, promising new technologies for particle physics research, and issues of gathering resources for long-term research in this area.

47 OTHER INSTRUMENTATION↗
DOE OSTI2012

Fabrication of 3D Silicon Sensors

Silicon sensors with a three-dimensional (3-D) architecture, in which the n and p electrodes penetrate through the entire substrate, have many advantages over planar silicon sensors including radiation hardness, fast time response, active edge and dual readout capabilities. The fabrication of 3D sensors is however rather complex. In recent years, there have been worldwide activities on 3D fabrication. SINTEF in collaboration with Stanford Nanofabrication Facility have successfully fabricated the original (single sided double column type) 3D detectors in two prototype runs and the third run is now on-going. This paper reports the status of this fabrication work and the resulted yield. The work of other groups such as the development of double sided 3D detectors is also briefly reported.

47 OTHER INSTRUMENTATION↗
DOE OSTI2012

Tracking Efficiency And Charge Sharing of 3D Silicon Sensors at Different Angles in a 1.4T Magnetic Field

A 3D silicon sensor fabricated at Stanford with electrodes penetrating throughout the entire silicon wafer and with active edges was tested in a 1.4 T magnetic field with a 180 GeV/c pion beam at the CERN SPS in May 2009. The device under test was bump-bonded to the ATLAS pixel FE-I3 readout electronics chip. Three readout electrodes were used to cover the 400 {micro}m long pixel side, this resulting in a p-n inter-electrode distance of {approx} 71 {micro}m. Its behavior was confronted with a planar sensor of the type presently installed in the ATLAS inner tracker. Time over threshold, charge sharing and tracking efficiency data were collected at zero and 15{sup o} angles with and without magnetic field. The latest is the angular configuration expected for the modules of the Insertable B-Layer (IBL) currently under study for the LHC phase 1 upgrade expected in 2014.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗