Engineering topics
Publications and source records attributed to Khattak, Chandra P..
A wafering machine having a multiplicity of wire cutting blades supported by a bladehead reciprocally moving past a workpiece supported by a holder that rocks about an axis perpendicular to the wires at a frequency less than the reciprocation of the bladehead.
A narrow wire blade with abrasive particles plated within a longitudinally-extending, plated cutting portion that extends from only one side of a wire core and has parallel side walls spaced by a controlled width.
In the growing of crystals, the formation of carbide contaminants is prevented by eliminating direct silica-graphite contact.