CSP and BGA assembly reliability in a fast ramp rate thermal cycle environment
Inspection results along with SEM and optical cross-sectional photos revealing damage and failure mechanisms will also be presented.
scale package FPBGA FCBGA↗
Engineering topics
Kim, N.
Publications and source records attributed to Kim, N..
Rapid qualification of CSP assemblies by increase of ramp rates and cycling temperature ranges
Team members representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package solder joint reliability BGA th↗
CSP Assembly Reliability and Effects of Underfill and Double-Sided Population
The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package CSP solder joint reliability un↗
CSP Assembly Reliability: Commercial and Harsh Environments
The JPL-led CSP Consortium of enterprises representing government agencies and private companies has jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package CSP Solder Joint Reliability Th↗
Reliability Assessment of COTS MEMS Components for Aerospace Environment
Research and development of Micro-Electro-Mechanical Systems (MEMS) in the last decade has shown a significant promise for a variety of commercial applications including automobile and medical purposes.
Aerospace Environment MEMS sensors COTS reliabilit↗
Reliability Issues of COTS MEMS for Aerospace Applications
This paper reviews the current status of MEMS packaging technology from COTS to specific application provides lessons learned, and finally, identifies a need for systematic approach for this purpose.
Commercial-Off-The-Shelf↗