Detecting wire-bond failures
Procedure detects wire-bond failures in thick-film substrates upon which many bonding pads are mounted.
Koudounaris, A.↗
Engineering topics
Koudounaris, A.
Publications and source records attributed to Koudounaris, A..
Engineering topics
Publications and source records attributed to Koudounaris, A..
Procedure detects wire-bond failures in thick-film substrates upon which many bonding pads are mounted.