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Kranbuehl, D. E.

Publications and source records attributed to Kranbuehl, D. E..

12 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1991

Sensor-model in-situ control of the RTM composite process

The paper reports on the use of in situ frequency dependent electromagnetic sensors (FDEMS) and the Loos resin transfer model to select and control the processing properties of an epoxy resin during RTM impregnation and cure. Once correlated with viscosity and degree of cure, FDEMS monitors the advancement of the resin, viscosity, and the impregnation of the fabric, allowing a direct means of monitoring in situ in the mold throughout the fabrication process the effects of time, temperature, vacuum, and pressure.

Kranbuehl, D. E.↗
NASA NTRS1988

Monitoring cure of composite resins using frequency dependent electromagnetic sensing techniques

A nondestructive in situ measurement technique has been developed for monitoring and measuring the cure processing properties of composite resins. Frequency dependent electromagnetic sensors (FDEMS) were used to directly measure resin viscosity during cure. The effects of the cure cycle and resin aging on the viscosity during cure were investigated using the sensor. Viscosity measurements obtained using the sensor are compared with the viscosities calculated by the Loos-Springer cure process model. Good overall agreement was obtained except for the aged resin samples.

Kranbuehl, D. E.↗
NASA NTRS1988

In-situ measurement of processing properties during fabrication in a production tool

Progress is reported on the use of frequency-dependent electromagnetic measurements (FDEMs) as a single, convenient technique for continuous in situ monitoring of polyester cure during fabrication in a laboratory and manufacturing environment. Preliminary FDEM sensor and modeling work using the Loss-Springer model in order to develop an intelligent closed-loop, sensor-controlled cure process is described. FDEMs using impedance bridges in the Hz to MHz region is found to be ideal for automatically monitoring polyester processing properties continuously throughout the cure cycle.

Kranbuehl, D. E.↗
NASA NTRS1987

Monitoring processing properties of high performance thermoplastics using frequency dependent electromagnetic sensing

An in situ NDE dielectric impedance measurement method has been developed for ascertaining the cure processing properties of high temperature advanced thermoplastic and thermosetting resins, using continuous frequency-dependent measurements and analyses of complex permittivity over 9 orders of magnitude and 6 decades of frequency at temperatures up to 400 C. Both ionic and Debye-like dipolar relaxation processes are monitored. Attention is given to LARC-TPI, PEEK, and poly(arylene ether) resins' viscosity, glass transition temperature, recrystallization, and residual solvent content and evolution properties.

Kranbuehl, D. E.↗
NASA NTRS1986

Characterization of the relationship of the cure cycle chemistry to cure cycle processing properties

Dynamic Dielectric measurements made over a wide range of frequency provide a sensitive and convenient means for monitoring the cure process in thermosets and thermoplastics. The measurement of dielectric relaxation is one of only a few instrumental techniques available for studying molecular properties in both the liquid and solid states. Furthermore, it is probably the only convenient experimental technique for studying the polymerization process of going from a monomeric liquid of varying viscosity to a crosslinked, insoluble, high temperature solid. The objective of the research is to develop on-line dielectric instrumentation for quantitative nondestructive material evaluation and closed loop smart cure cycle control. The key is to relate the chemistry of the cure cycle process to the dielectric properties of the polymer system by correlating the time, temperature, and frequency dependent dielectric measurements with chemical characterization measurements. Measurement of the wide variation in magnitude of the complex permittivity with both frequency and state of cure, coupled with chemical characterization work, have been shown in the laboratory to have the potential to determine: resin quality, composition and age; cure cycle window boundaries; onset of flow and point of maximum flow; extent of and completion of reaction; evolution of volatiles; T sub g; and, crosslinking and molecular weight buildup.

Kranbuehl, D. E.↗
NASA NTRS1986

Dynamic dielectric analysis - A nondestructive cure process monitoring method

The cure processes of TGDDM-based epoxy thermosets and polysulfone thermoplastic resins were monitored by means of computer-controlled dynamic dielectric measurements made at frequencies 5 Hz to 5 million Hz. The values of capacitance and conductance were recorded, and the data were used to calculate the complex permittivity, an intensive property which is characteristic of the material's state of cure and independent of the amount of material measured. The frequency dependence of the complex permittivity value was used to determine the conductivity and mean relaxation time. The conductivity which is also an intensive variable and is independent of sample size, was correlated with the viscosity in both the epoxy and polysulfone systems.

Kranbuehl, D. E.↗
NASA NTRS1986

Dynamic dielectric analysis for nondestructive cure monitoring and process control

Dynamic dielectric analysis (DDA) is an effective in situ NDE method that can monitor the reaction status in thermosets and the phase changes in thermoplastics, including slow reactions occuring late in the cure cycle and recrystallization during annealing. The effects of moisture and resin history on reaction rate can also be determined, as can ionic and dipolar contributions. The ionic mobility parameter is noted to be an excellent monitor of viscosity above the glass transition temperature. The ability of DDA to monitor cure rate variations in a thick section during autoclaving has been demonstrated.

Kranbuehl, D. E.↗
NASA NTRS1985

Characterization of the relationship of the cure cycle chemistry to cure cycle processing properties

Dynamic dielectric analysis (DDA) is used to study curing polymer systems and thermoplastics. Measurements are made over a frequency range of six decades. This wide range of frequencies increases the amount of information which can be obtained. The data is analyzed in terms of the frequency dependence of the complex permittivity epsilon sup *, specific conductivity sigma (ohm/cm) and the relaxation time tau, parameters which are characteristic of the cure state of the material and independent of the size of the sample.

Kranbuehl, D. E.↗
NASA NTRS1984

Dynamic dielectric characterization of thermosets and thermoplastics using intrinsic variables

Dynamic dielectric analysis has been used to study curing polymer systems and thermoplastics. Measurements have been made over a frequency range of six decades. The data are analyzed in terms of capacitance, conductance, dissipation, complex permittivity, and conductivity (sigma). Complex permittivity and sigma are properties which are characteristic of the cure state of the material and independent of the size of the sample. LARC-160, PMR-15, NARMCO 5208, Epon and UDEL-P1700 have been studied. The experimental results suggest that when ionic processes dominate the dielectric response, the intensive property sigma is a good monitor of the resin's viscosity.

Kranbuehl, D. E.↗
NASA NTRS1982

Development of critical molecular weight-property specifications for high performance polymers used as adhesives and composites

The polyimide resin, LARC-160, was prepared from diethyl-3, 3', 4,4'-benzophenone tetracarboxylate, ethyl-5-norbornene-2,3-dicarboxylate and Jeffamine AP-22. The imidization reactions of NE and BTDE were studied by HPLC, C-13-NMR and IR. NE imidizes slowly at 12 C; BTDE imidizes when the resin is heated above 100 C. Both imidization reactions proceed directly to the imide. Neither amic acid is present in significant quantities at any stage of the imidization reactions. The monomer mixture was stored at 12 C for periods up to 14 months. The effects of resin aging at this temperature on the chemical composition of the resin monomer mixture and the imidized polymer formed on curing were investigated. Aging the resin monomer mixture has the effect of partially advancing the imidization reaction. The average size of the cured polymer increases slightly with resin age.

Kranbuehl, D. E.↗