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Kreisman, W. S.

Publications and source records attributed to Kreisman, W. S..

At least 19 records

Design, fabrication and performance of high efficiency photovoltaic modules

Design details and performance and environmental test results of newly developed high performance and reliability photovoltaic modules are presented. Efficiencies averaging 14.3% for 3040 cells were obtained by using ion implantation for cell junction and back surface field formation. 152 rectangular (6.0 cm x 4.6 cm) cells arranged with a 97% local packing density comprise the circuit assembly, and cells are wired 4 in parallel by 38 in series. The top cover of the superstrate design module is composed of tempered low-iron glass to provide transparent protection for the optical surface. Results show that this design has an encapsulation system which does not fail in the event of reverse-bias operation, and an average module efficiency of 12.2% was achieved at a 58.6W power which varied only 2% among all 20 modules.

Nowlan, M. J.

Development of glass encapsulation techniques for terrestrial photovoltaic arrays

Two parallel development programs for terrestrial solar cell module encapsulation and fabrication are reviewed, including the status of electrostatic bonding as an encapsulation technique. Current designs of electrostatically bonded modules are discussed, fabrication of which is now routine. The design of a high-efficiency module is presented, for which performance reliability features are discussed. This design is compatible with later generation changes such as the introduction of encapsulation by electrostatic bonding. Application of wire mesh contacts by electrostatic bonding has resulted in I-V curve fill factors of 0.74. Cell designs that would allow existing Pyrex glass to be used in electrostatically bonded modules are presented.

Younger, P. R.

Integral Glass Encapsulation for Solar Arrays

Work reported was performed during the period from August 1977 to December 1978. The program objective was to continue the development of electrostatic bonding (ESB) as an encapsulation technique for terrestrial cells. Economic analyses shows that this process can be a cost-effective method of producing reliable, long lifetime solar modules. When considered in sufficient volume, both material and equipment costs are competitive with conventional encapsulation systems. In addition, the possibility of integrating cell fabrication into the encapsulation process, as in the case of the preformed cell contacts discussed in this report, offers the potential of significant overall systems cost reduction.

Younger, P. R.

Terrestrial solar arrays with integral glass construction

An excellent encapsulation system for a terrestrial solar array can be formed using two sheets of glass. Superior technical character, very low cost and simple assembly can result if the active components and the glass sheets are integrally bonded together such that the array is hermetically sealed without employing organic encapsulation materials. Such an approach is being developed using electrostatic bonding. Status of this development is described. Functioning integral glass test modules have been fabricated and subjected to environmental testing. Results have been excellent.

Younger, P. R.

Integral glass sheet encapsulation for terrestrial panel applications

Concepts for integral glass sheet encapsulation of terrestrial solar cell modules using techniques based upon electrostatic bonding are being developed. It is possible for the glass to provide hermetic encapsulation, the structural support, and a vehicle for integral interconnection of the solar cells. Anticipated capabilities, present status, and cost projections for large scale terrestrial utilization are discussed.

Minnucci, J. A.

Design, fabrication, assembly and delivery of a laboratory prototype of a residual gas analyzer

The design, development, and testing of a wide mass range residual gas analyzer which will be one component of an integrated real time contamination monitor system are described. The instrument has been developed and tested to the laboratory prototype phase, demonstrating the performance that can be expected from a flight instrument of similar design. The instrument's analyzer is of the quadrupole type and a cold cathode ion source is employed as the ionizer. The associated electronics supply all necessary operating and mass sweep voltages for the ionizer, analyzer and electron multiplier ion detector. The instrument features a very fast linear electrometer with automatic range changing. The full mass range of 2 to 300 amu is automatically and repetitively scanned every sixty seconds and suitable telemetry outputs are provided for intensity and mass identification as well as a digital identification of the electrometer range.

Kreisman, W. S.

Cold cathode ionization gage has rigid metal housing

Cold cathode ionization gage in a stainless steel housing accurately measures high pressures. The penning effect is used with a high voltage discharge in the presence of a magnetic field for an ion current proportional to the gas pressure in the gage.

Herzog, R.

Baking enables McLeod gauge to measure in ultrahigh vacuum range

Accurate measurements in the ultrahigh vacuum range by a conventional McLeod gage requires degassing of the gage's glass walls. A closed system, in which mercury is forced into the gage by gravity alone, and in which the gage components are baked out for long periods, is used to achieve this degassing.

Kreisman, W. S.

Bakeable McLeod gauge

A low pressure gauge of the McLeod type demonstrating superior performance and measuring characteristics is described. A mercury reservoir which is kept in a vacuum at all times as well as bakeable glass components to reduce contamination are featured.

Kreisman, W. S.