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Kutscha, Eileen O.

Publications and source records attributed to Kutscha, Eileen O..

Optically Enhanced Bonding Workstation for Robust Bonding

Process control is one of the methods recommended by the FAA to reduce risk in fabrication of structurally bonded composite joints for aircraft structure based on guidance provided in circular AC-107B for certification of structurally bonded joints. An Optically Enhanced Bonding Workstation is presented here that reduces the risk in bonded joint fabrication. Results will be presented demonstrating the benefits of process monitoring and its ability to reduce risk in performing pre-bond composite surface preparation steps. This supports reduction in the timeline to certification of bonded composite structures through development of a robust bonding process upstream of any part certification steps. Sanding surface preparation has been identified as a high risk process step that is known to impact bond performance. Control of sanding during surface preparation can be performed using portable surface analysis tools previously identified including included gloss, color, Fourier Transform Infrared spectroscopy (FTIR) and optically stimulated electron emissions (OSEE). Threshold limits for the surface analysis tool measurements were determined based on an example objective bonding system utilizing a common EA9394 paste adhesive measured using standard double cantilever beam fracture toughness testing. The patented Optically Enhanced Bonding Workstation (OEBW), was tailored to monitor and control the epoxy composite surface preparation step. Surface analysis tool threshold limits were incorporated into the OEBW to demonstrate improved composite bond performance through process control. The surface analysis tools investigated here can easily be incorporated into an automated system due to their applicability to rapidly quantify the composite sanded surface treatment and their portability.

Kutscha, Eileen O.

Robust Bonding Through Process Control

Process control has been proven to be the most reliable means of safeguarding the quality of adhesive bonds according to Federal Aviation Administration (FAA). A method for implementing process control for reduction in risk in a bonded joint fabrication process is demonstrated in this study using a selected bonding system. The stepwise method included risk analysis to identify defects with the highest impact and likelihood to occur, evaluation of various pre-bond surface analysis tools to monitor for the selected defects, and demonstration of the benefits of in-process monitoring utilizing threshold limits determined from bond performance tests. The bonded system selected for investigation was an aerospace carbon fiber epoxy composite substrate surface prepared with random orbital sanding using 180 grit aluminum oxide sand paper. A series of portable, pre-bond surface analysis tools were investigated for their ability to be used for in-line bond process control. Results and threshold limits are presented from roughness, ballistic water contact angle (WCA), color, gloss, and Fourier transform infrared spectroscopy (FTIR) surface analysis tools. Results demonstrated how in-process inspection methods can be used to ensure quality of a surface preparation for a selected bonding system. A framework is provided for implementation of bond process control for robust bonding.

Kutscha, Eileen O.

Contamination and Surface Preparation Effects on Composite Bonding

Results presented here demonstrate the effect of several prebond surface contaminants (hydrocarbon, machining fluid, latex, silicone, peel ply residue, release film) on bond quality, as measured by fracture toughness and failure modes of carbon fiber reinforced epoxy substrates bonded in secondary and co-bond configurations with paste and film adhesives. Additionally, the capability of various prebond surface property measurement tools to detect contaminants and potentially predict subsequent bond performance of three different adhesives is also shown. Surface measurement methods included water contact angle, Dyne solution wettability, optically stimulated electron emission spectroscopy, surface free energy, inverse gas chromatography, and Fourier transform infrared spectroscopy with chemometrics analysis. Information will also be provided on the effectiveness of mechanical and energetic surface treatments to recover a bondable surface after contamination. The benefits and drawbacks of the various surface analysis tools to detect contaminants and evaluate prebond surfaces after surface treatment were assessed as well as their ability to correlate to bond performance. Surface analysis tools were also evaluated for their potential use as in-line quality control of adhesive bonding parameters in the manufacturing environment.

Kutscha, Eileen O.