Model-Based Systems Engineering Approach to Managing Mass Margin
No abstract available
mass equipment lists (MELs)↗
Engineering topics
Lam, D.
Publications and source records attributed to Lam, D..
Thermal cycling test results of CSP and RF assemblies
A JPL-led chip scale package (CSP) Consortium of enterprises, composed of representing agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package CSP thermal cycle solder joint ↗