Engineering topics
Publications and source records attributed to Langenbacher, H..
A neural network experiment conducted for the Space Technology Research Vehicle (STRV-1) 1-b launched in June 1994. Identical sets of analog feed-forward neural network chips was used to study and compare the effects of space and ground radiation on the chips. Three failure mechanisms are noted.
Simulated mine detection was performed on a polarimetric hyperspectral imaging dataset collected by using an acousto-optic tunable filter camera. A feedforward artificial neural network was programmed to recognize predefined spectral "templates." The simulation results are provided along with the preprocessing steps and window sizes leading to mine detection without false alarms.
A VLSI-based analog processor for fully parallel, associative, high-speed pattern matching is reported. The processor consists of two main components: an analog memory matrix for storage of a library of patterns, and a winner-take-all (WTA) circuit for selection of the stored pattern that best matches an input pattern. An inner product is generated between the input vector and each of the stored memories. The resulting values are applied to a WTA network for determination of the closest match. Patterns with up to 22 percent overlap are successfully classified with a WTA settling time of less than 10 microsec. Applications such as star pattern recognition and mineral classification with bounded overlap patterns have been successfully demonstrated. This architecture has a potential for an overall pattern matching speed in excess of 10 exp 9 bits per second for a large memory.
A binary synaptic matrix chip has been developed for electronic neural networks. The matrix chip contains a programmable 32X32 array of 'long channel' NMOSFET binary connection elements implemented in a 3-micron bulk CMOS process. Since the neurons are kept off-chip, the synaptic chip serves as a 'cascadable' building block for a multi-chip synaptic network as large as 512X512 in size. As an alternative to the programmable NMOSFET (long channel) connection elements, tailored thin film resistors are deposited, in series with FET switches, on some CMOS test chips, to obtain the weak synaptic connections. Although deposition and patterning of the resistors require additional processing steps, they promise substantial savings in silicon area. The performance of synaptic chip in a 32-neuron breadboard system in an associative memory test application is discussed.