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Lanni, F.

Publications and source records attributed to Lanni, F..

16 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Development of a FELIX based readout system for ITk strip hybrid module demonstrator for ATLAS Phase-II Upgrade

The Large Hadron Collider (LHC) will undergo a major upgrade around 2024 with a roughly tenfold increase in luminosity. It results in corresponding increases in particle rates and radiation doses that the current ATLAS Inner Tracking Detector cannot cope with. Therefore the ATLAS experiment will build a new all-silicon tracking system called the ITk (Inner Tracker) that includes an inside pixel detector close to the beam line and a strip detector in outside layer. Meanwhile the ATLAS experiment will adopt the Front-End Link eXchange (FELIX) system as the interface between the data acquisition and front-end electronics for all sub-detectors in the Phase II Upgrade. In this contribution, we present a prototype of FELIX based readout system for the strip hybrid module. Its hardware, firmware and software GUI application will be discussed, as well as integration test results.

73 NUCLEAR PHYSICS AND RADIATION PHYSICS↗
DOE OSTI2019

A data acquisition system for HV-CMOS sensor research and development in the upgrade of ATLAS experiment

In the High Luminosity LHC (HL-LHC) upgrade of ATLAS experiment in 2026, the new inner tracker detector will be installed. As a promising candidate for the outer layer of the inner tracker detector, the High Voltage CMOS (HV-CMOS) pixel sensors are being investigated by the ATLAS collaboration. A Front-End LInk eXchange (FELIX) based Data Acquisition (DAQ) system is developed for the R&D of the HV-CMOS sensors. A FELIX card with PCIe interface in the back-end is used to control, monitor, calibrate and read out the front-end electronics. In the front-end, a Xilinx evaluation board ZC706 works as the interface between the back- end and custom boards with HV-CMOS sensors and the readout ASIC. In conclusion, the DAQ system was successfully deployed for the testbeam experiment at CERN. Design of the DAQ system, the tuning of sensors and testbeam results will be described in details.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2019

Development of FELIX based readout system for HV-CMOS sensor testbeam

The High Voltage CMOS (HV-CMOS) sensors are extensively investigated by the ATLAS collaboration for the High-Luminosity LHC (HL-LHC) upgrade of the Inner Tracker (ITk) detector. The HV-CMOS technology is a commercial integrated circuit process with the advantages of monolithic readout and fast charge collection. A front-end test platform of CaRIBOu (Control and Readout Itk BOard) and a testbeam Telescope based on the ATLAS IBL (Insertable B-Layer) silicon pixel modules, have been developed for the HV-CMOS sensor study and characterization in testbeam experiments. The Front-End LInk eXchange (FELIX) system is a newapproach to function as the gateway between detector front-end electronics and the commodity switched network in the ATLAS upgrade. A FELIX based readout system has been developed for both the CaRIBOu and the testbeam Telescope. It has been deployed successfully in the testbeam at theCERNSPS H8 beamline in August 2017. The test results show that the readout system is capable of sensor calibration and readout of a high-density pixel detector with high trigger rate in testbeam experiments.

47 OTHER INSTRUMENTATION↗
DOE OSTI2018

Test beam measurement of ams H35 HV-CMOS capacitively coupled pixel sensor prototypes with high-resistivity substrate

In the context of the studies of the ATLAS High Luminosity LHC programme, radiation tolerant pixel detectors in CMOS technologies are investigated. To evaluate the effects of substrate resistivity on CMOS sensor performance, the H35DEMO demonstrator, containing different diode and amplifier designs, was produced in ams H35 HV-CMOS technology using four different substrate resistivities spanning from 80 cm to 1000 cm. A glueing process using a high-precision flip-chip machine was developed in order to capacitively couple the sensors to FE-I4 Readout ASIC using a thin layer of epoxy glue with good uniformity over a large surface. The resulting assemblies were measured in beam test at the Fermilab Test Beam Facilities with 120 GeV protons and CERN SPS H8 beamline using 180 GeV pions. Furthermore, the in-time efficiency and tracking properties measured for the different sensor types are shown to be compatible with the ATLAS ITk requirements for its pixel sensors.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2018

Charge collection characterisation with the Transient Current Technique of the ams H35DEMO CMOS detector after proton irradiation

This paper reports on the characterisation with Transient Current Technique measurements of the charge collection and depletion depth of a radiation-hard high-voltage CMOS pixel sensor produced at ams AG. Several substrate resistivities were tested before and after proton irradiation with two different sources: the 24 GeV Proton Synchrotron at CERN and the 16.7 MeV Cyclotron at Bern Inselspital.

47 OTHER INSTRUMENTATION↗
DOE OSTI2018

The implementation of Global Feature EXtractor (gFEX) - the ATLAS Calorimeter Level 1 Trigger system for LHC Run-3 upgrade

As part of the ATLAS Phase-I Upgrade, the global Feature EXtractor (gFEX) is one of several hardware modules designed to help maintain the ATLAS Level-1 trigger acceptance rate with the increasing Large Hadron Collider (LHC) luminosity and the increasing Pile-Up conditions. The gFEX is used to identify patterns of energy associated with the hadronic decays of high momentum Higgs, W & Z bosons, top quarks, and exotic particles in real time at the 40 MHz LHC bunch crossing rate. The board is required to receive coarse-granularity (Δη×Δphiv = 0.2×0.2 gTower) information from the entire ATLAS calorimeters on 276 optical fibers. A prototype v1 with one Xilinx ZYNQ FPGA, and one Vertex-7 FPGA for technology validation has been designed and tested in 2015. With the lessons learned from the prototype v1, a prototype v2 with three Vertex UltraScale FPGAs and one ZYNQ FPGA has been implemented to verify full functionalities of gFEX in 2016. Based on the prototype v2 design, a prototype v3, the final gFEX prototype, is implemented, which is an ATCA module consisting of three Vertex UltraScale+ FPGAs, one ZYNQ UltraScale+ SoC, and 35 MiniPODs. This board receives up to 300 fiber optical links from calorimeters and transmits trigger data on 96 links to the to the ATLAS Level-1 Topological trigger (L1Topo [1]) at the speed up to 12.8 Gb/s. There are also 24 electrical links on board for communication between two FPGAs with the speed up to 25.6 Gb/s. The performance of three prototype boards have been tested and evaluated. For the prototype v3 board, the high-speed optical links are stable at 12.8 Gb/s with Bit Error Ratio (BER) < 1 × 10 -15 . The low-latency parallel GPIO (General Purpose I/O) buses between FPGAs are stable at 1.12 Gb/s. The peripheral components of ZYNQ UltraScale+ SoC, such as 16 GB DDR4 DIMM, UART, SPI flashes, and Ethernet, have also been verified. Here, the test results of the prototype v3 board validate the gFEX technologies, architecture and full functionalities. Now the final production board is being produced.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2018

Beam test measurements of Low Gain Avalanche Detector single pads and arrays for the ATLAS High Granularity Timing Detector

For the high luminosity upgrade of the LHC at CERN, ATLAS is considering the addition of a High Granularity Timing Detector (HGTD) in front of the end cap and forward calorimeters at (z) = 3.5 m and covering the region 2.4 < (Eta) < 4 to help reducing the effect of pile-up. The chosen sensors are arrays of 50 Mu-m thin Low Gain Avalanche Detectors (LGAD). This paper presents results on single LGAD sensors with a surface area of 1.3x1.3 mm2 and arrays with 2x2 pads with a surface area of 2x2 mm2 or 3x3 mm2 each and different implant doses of the p+ multiplication layer. They are obtained from data collected during a beam test campaign in autumn 2016 with a pion beam of 120 GeV energy at the CERN SPS. In addition to several quantities measured inclusively for each pad, the gain, efficiency and time resolution have been estimated as a function of the position of the incident particle inside the pad by using a beam telescope with a position resolution of few Mu-m. Different methods to measure the time resolution are compared, yielding consistent results. The sensors with a surface area of 1.3x1.3 mm 2 have a time resolution of about 40 ps for a gain of 20 and of about 27 ps for a gain of 50 and fulfill the HGTD requirements. Larger sensors have, as expected, a degraded time resolution. All sensors show very good efficiency and time resolution uniformity.

24 POWER TRANSMISSION AND DISTRIBUTION↗
DOE OSTI2018

Testbeam results of irradiated ams H18 HV-CMOS pixel sensor prototypes

HV-CMOS pixel sensors are a promising option for the tracker upgrade of the ATLAS experiment at the LHC, as well as for other future tracking applications in which large areas are to be instrumented with radiation-tolerant silicon pixel sensors. We present results of testbeam characterisations of the 4 th generation of Capacitively Coupled Pixel Detectors (CCPDv4) produced with the ams H18 HV-CMOS process that have been irradiated with different particles (reactor neutrons and 18 MeV protons) to fluences between 1×10 14 and 5×10 15 1–MeV– n eq . The sensors were glued to ATLAS FE-I4 pixel readout chips and measured at the CERN SPS H8 beamline using the FE-I4 beam telescope. Results for all fluences are very encouraging with all hit efficiencies being better than 97% for bias voltages of 85 V. The sample irradiated to a fluence of 1×10 15 neq—a relevant value for a large volume of the upgraded tracker—exhibited 99.7% average hit efficiency. Furthermore, the results give strong evidence for the radiation tolerance of HV-CMOS sensors and their suitability as sensors for the experimental HL-LHC upgrades and future large-area silicon-based tracking detectors in high-radiation environments.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2017

Development of a modular test system for the silicon sensor R&D of the ATLAS Upgrade

High Voltage CMOS sensors are a promising technology for tracking detectors in collider experiments. Extensive R&D studies are being carried out by the ATLAS Collaboration for a possible use of HV-CMOS in the High Luminosity LHC upgrade of the Inner Tracker detector. CaRIBOu (Control and Readout Itk BOard) is a modular test system developed to test Silicon based detectors. It currently includes five custom designed boards, a Xilinx ZC706 development board, FELIX (Front-End LInk eXchange) PCIe card and a host computer. A software program has been developed in Python to control the CaRIBOu hardware. CaRIBOu has been used in the testbeam of the HV-CMOS sensor AMS180v4 at CERN. Preliminary results have shown that the test system is very versatile. In conclusion, further development is ongoing to adapt to different sensors, and to make it available to various lab test stands.

43 PARTICLE ACCELERATORS↗
DOE OSTI2016

FELIX: a PCIe based high-throughput approach for interfacing front-end and trigger electronics in the ATLAS Upgrade framework

The ATLAS Phase-I upgrade (2019) requires a Trigger and Data Acquisition (TDAQ) system able to trigger and record data from up to three times the nominal LHC instantaneous luminosity. Furthermore, the Front-End LInk eXchange (FELIX) system provides an infrastructure to achieve this in a scalable, detector agnostic and easily upgradeable way. It is a PC-based gateway, interfacing custom radiation tolerant optical links from front-end electronics, via PCIe Gen3 cards, to a commodity switched Ethernet or InfiniBand network. FELIX enables reducing custom electronics in favour of software running on commercial servers. Here, the FELIX system, the design of the PCIe prototype card and the integration test results are presented.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2016

Results of the 2015 testbeam of a 180 nm AMS High-Voltage CMOS sensor prototype

We investigated the active pixel sensors based on the High-Voltage CMOS technology as a viable option for the future pixel tracker of the ATLAS experiment at the High-Luminosity LHC. Our paper reports on the testbeam measurements performed at the H8 beamline of the CERN Super Proton Synchrotron on a High-Voltage CMOS sensor prototype produced in 180 nm AMS technology. These results in terms of tracking efficiency and timing performance, for different threshold and bias conditions, are shown.

46 INSTRUMENTATION RELATED TO NUCLEAR SCIENCE AND ↗
DOE OSTI2015

Evaluation of commercial ADC radiation tolerance for accelerator experiments

Electronic components used in high energy physics experiments are subjected to a radiation background composed of high energy hadrons, mesons and photons. These particles can induce permanent and transient effects that affect the normal device operation. Ionizing dose and displacement damage can cause chronic damage which disable the device permanently. Transient effects or single event effects are in general recoverable with time intervals that depend on the nature of the failure. The magnitude of these effects is technology dependent with feature size being one of the key parameters. Analog to digital converters are components that are frequently used in detector front end electronics, generally placed as close as possible to the sensing elements to maximize signal fidelity. We report on radiation effects tests conducted on 17 commercially available analog to digital converters and extensive single event effect measurements on specific twelve and fourteen bit ADCs that presented high tolerance to ionizing dose. We discuss mitigation strategies for single event effects (SEE) for their use in the large hadron collider environment.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗
DOE OSTI2012

Long-Baseline Neutrino Experiment (LBNE)

The US department of energy approved the Mission Need (CD-0) for a long baseline neu trino experiment on January 8th 2010. This marked the official start of the LBNE project whose goal is to plan and execute the construction of a next generation neutrino experiment designed to measure neutrino oscillation parameters with a neutrino beam from Fermilab detected in a large detector a mile underground in the former Homestake mine in South Dakota.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗