Methods of using fluoroepoxy compounds as adhesives for fluoroplastic adherends and products made therefrom
Fluoroepoxy compounds are made by reacting a fluoroepoxy resin with an effective curing agent, such as an adduct amine, and, while the compound is sufficiently liquid to wet a fluoroplastic surface, it may be applied to a fluoroplastic adherend, such as a Teflon, to be employed as an adhesive, to form various fluoroplastic products, without requiring any surface treatment of the adherend. The compounds are intentionally formulated with high fluorine contents, normally above 46% by weight, preferably for bonding fluoroplastics with a high F-content, above 55% by weight.