Engineering topics

Lei, Jih-Fen

Publications and source records attributed to Lei, Jih-Fen.

At least 19 records

NASA NTRS2002

Instrumentation and Controls Division Overview: Sensors Development for Harsh Environments at Glenn Research Center

The Instrumentation and Controls Division is responsible for planning, conducting and directing basic and applied research on advanced instrumentation and controls technologies for aerospace propulsion and power applications. The Division's advanced research in harsh environment sensors, high temperature high power electronics, MEMS (microelectromechanical systems), nanotechnology, high data rate optical instrumentation, active and intelligent controls, and health monitoring and management will enable self-feeling, self-thinking, self-reconfiguring and self-healing Aerospace Propulsion Systems. These research areas address Agency challenges to deliver aerospace systems with reduced size and weight, and increased functionality and intelligence for future NASA missions in advanced aeronautics, economical space transportation, and pioneering space exploration. The Division also actively supports educational and technology transfer activities aimed at benefiting all humankind.

Zeller, Mary V.↗

NASA NTRS2002

Advanced Measurement Systems Available to PIWG Members

It was developed advanced measurement technologies to meet NASA goals: reduce design cycle time, reduce emission, reduce testing time, increase safety. The technology are saving money. This technology are available now for technology transfer: optical diagnostics, the film technology and MEMS devices.

Anderson, Robert↗

NASA NTRS2000

Durability Evaluation of a Thin Film Sensor System With Enhanced Lead Wire Attachments on SiC/SiC Ceramic Matrix Composites

An advanced thin film sensor system instrumented on silicon carbide (SiC) fiber reinforced SiC matrix ceramic matrix composites (SiC/SiC CMCs), was evaluated in a Mach 0.3 burner rig in order to determine its durability to monitor material/component surface temperature in harsh environments. The sensor system included thermocouples in a thin film form (5 microns thick), fine lead wires (75 microns diameter), and the bonds between these wires and the thin films. Other critical components of the overall system were the heavy, swaged lead wire cable (500 microns diameter) that contained the fine lead wires and was connected to the temperature readout, and ceramic attachments which were bonded onto the CMCs for the purpose of securing the lead wire cables, The newly developed ceramic attachment features a combination of hoops made of monolithic SiC or SiC/SiC CMC (which are joined to the test article) and high temperature ceramic cement. Two instrumented CMC panels were tested in a burner rig for a total of 40 cycles to 1150 C (2100 F). A cycle consisted of rapid heating to 1150 C (2100 F), a 5 minute hold at 1150 C (2100 F), and then cooling down to room temperature in 2 minutes. The thin film sensor systems provided repeatable temperature measurements for a maximum of 25 thermal cycles. Two of the monolithic SiC hoops debonded during the sensor fabrication process and two of the SiC/SiC CMC hoops failed during testing. The hoops filled with ceramic cement, however, showed no sign of detachment after 40 thermal cycle test. The primary failure mechanism of this sensor system was the loss of the fine lead wire-to-thin film connection, which either due to detachment of the fine lead wires from the thin film thermocouples or breakage of the fine wire.

Lei, Jih-Fen↗

NASA NTRS2000

Packaging Technology Developed for High-Temperature SiC Sensors and Electronics

A ceramic- and thick-film-materials-based prototype electronic package designed for silicon carbide (SiC) high-temperature sensors and electronics has been successfully tested at 500 C in an oxygen-containing air environment for 500 hours. This package was designed, fabricated, assembled, and electronically evaluated at the NASA Glenn Research Center at Lewis Field with an in-house-fabricated SiC semiconductor test chip. High-temperature electronics and sensors are necessary for harsh-environment space and aeronautical applications, such as space missions to the inner solar system or the emission control electronics and sensors in aeronautical engines. Single-crystal SiC has such excellent physical and chemical material properties that SiC-based semiconductor electronics can operate at temperatures over 600 C, which is significantly higher than the limit for Si-based semiconductor devices. SiC semiconductor chips were recently demonstrated to be operable at temperatures as high as 600 C, but only in the probe station environment because suitable packaging technology for sensors and electronics at temperatures of 500 C and beyond did not exist. Thus, packaging technology for SiC-based sensors and electronics is immediately needed for both application and commercialization of high-temperature SiC sensors and electronics. In response to this need, researchers at Glenn designed, fabricated, and assembled a prototype electronic package for high-temperature electronics, sensors, and microelectromechanical systems (MEMS) using aluminum nitride (AlN) substrate and gold (Au) thick-film materials. This prototype package successfully survived a soak test at 500 C in air for 500 hours. Packaging components tested included thick-film high-temperature metallization, internal wire bonds, external lead bonds, and a SiC diode chip die-attachment. Each test loop, which was composed of thick-film printed wire, wire bond, and lead bond was subjected to a 50-mA direct current for 250 hours at 500 C.

Chen, Liang-Yu↗

NASA NTRS1999

Sensor Lead Wires Positioned on SiC-based Monolithic Ceramic and Fiber- reinforced Ceramic Matrix Composite Subcomponents with Flat and Curved Surfaces

There is strong interest in the development of silicon carbide-based monolithic ceramic and composite materials and components for demanding, high-temperature applications. Thorough characterization of material properties, including high-temperature testing under simulated or actual operating conditions, is a high priority for programs involved in developing these silicon carbide- (SiC) based materials and components. Members of the Sensors and Electronics Technology Branch at the NASA Lewis Research Center are developing minimally intrusive methods of measuring the properties (such as the surface temperature, strain, and heat flux characteristics) of components and subelements that are being tested or operated in hostile, high-temperature environments. Their primary goal is to instrument the test article or operating component with durable sensors that have a minimal effect on test conditions such as the gas flow across the surface of the item and the material response (including the through-thickness conduction of heat). Therefore, the main thrust of their work has been the development of thin-film sensors (e.g., thermocouples or strain gauges) for use on various advanced material test articles, including SiC/SiC composite components. There was a need for a better method of securing sensor lead wires on SiC-based components and subelements that would be tested at temperatures to 1000 C (or higher), to enhance the durability of the overall minimally intrusive sensor system. To address this need, Lewis researchers devised an alternative approach for positioning the sensor lead wires (which are connected to the thin-film sensors) on SiC or SiC/SiC components. A reaction-forming method of joining was used to strongly bond hoop-shaped monolithic SiC and SiC/SiC composite attachments of various sizes to both flat and curved surfaces of SiC/SiC composite subelements (see the photos). This approach is based on an affordable, robust ceramic joining technology, named ARCJoinT, which was developed at Lewis for the joining of SiC-based ceramics and fiber-reinforced composites.

Kiser, James D.↗

NASA NTRS1999

Diffusion Barriers to Increase the Oxidative Life of Overlay Coatings

Currently, most blades and vanes in the hottest section of aero gas turbine engines require some type of coating for oxidation protection. Newly developed single crystal superalloys have the mechanical potential to operate at increasingly higher component temperatures. However, at these elevated temperatures, coating/substrate interdiffusion can shorten the protective life of the coating. Diffusion barriers between overlay coatings and substrates are being examined to extend the protective life of the coating. A previously- developed finite-difference diffusion model has been modified to predict the oxidative life enhancement due to use of a diffusion barrier. The original diffusion model, designated COSIM, simulates Al diffusion in the coating to the growing oxide scale as well as Al diffusion into the substrate. The COSIM model incorporates an oxide growth and spalling model to provide the rate of Al consumption during cyclic oxidation. Coating failure is predicted when the Al concentration at the coating surface drops to a defined critical level. The modified COSIM model predicts the oxidative life of an overlay coating when a diffusion barrier is present eliminating diffusion of Al from the coating into the substrate. Both the original and the modified diffusion models have been used to predict the effectiveness of a diffusion barrier in extending the protective life of a NiCrAl overlay coating undergoing cyclic oxidation at 1100 C.

Nesbitt, James A.↗

NASA NTRS1998

Attachment of Free Filament Thermocouples for Temperature Measurements on Ceramic Matrix Composites

At the NASA Lewis Research Center, a new installation technique utilizing convoluted wire thermocouples (TC's) was developed and proven to produce very good adhesion on CMC's, even in a burner rig environment. Because of their unique convoluted design, such TC's of various types and sizes adhere to flat or curved CMC specimens with no sign of delamination, open circuits, or interactions-even after testing in a Mach 0.3 burner rig to 1200 C (2200 F) for several thermal cycles and at several hours at high temperatures. Large differences in thermal expansion between metal thermocouples and low-expansion materials, such as CMC's, normally generate large stresses in the wires. These stresses cause straight wires to detach, but convoluted wires that are bonded with strips of coating allow bending in the unbonded portion to relieve these expansion stresses.

Lei, Jih-Fen↗

NASA NTRS1998

Thin Film Sensors for Minimally-Intrusive Measurements in Harsh High Temperature Environment

Advanced thin film sensors are being developed to provide accurate surface temperature, heat flux and strain measurements for components used in hostile propulsion environments. These sensors are sputter deposited and microfabricated directly onto the test articles with no additional bonding agent. The thickness of the sensors is only a few micrometers which creates minimal disturbance of the gas flow over the test surface. Thus thin film sensors have the advantage over conventional wire- based sensors by providing minimally intrusive measurement and having a faster response. These thin film sensors are being developed for characterization of advanced materials and structures in hostile, high-temperature environments, and for validation of design codes. This paper presents the advances of three high temperature thin film sensor technologies developed at NASA Lewis Research Center: thermocouples, heat-flux gages and strain gages. The fabrication techniques of these thin film sensors which include physical vapor deposition, photolithography patterning and lead Wire attachment are described. Sensors demonstrations on a variety of engine materials, including superalloys, ceramics and advanced ceramic matrix composites, in several hostile, high-temperature test environments are presented. The advantages and limitations of thin film sensor technology are also discussed.

Lei, Jih-Fen↗

NASA NTRS1997

Attachment of Free Filament Thermocouples for Temperature Measurements on CMC

Ceramic Matrix Composites (CMC) are being developed for use as enabling materials for advanced aeropropulsion engine and high speed civil transport applications. The characterization and testing of these advanced materials in hostile, high-temperature environments require accurate measurement of the material temperatures. Commonly used wire Thermo-Couples (TC) can not be attached to this ceramic based material via conventional spot-welding techniques. Attachment of wire TC's with commercially available ceramic cements fail to provide sufficient adhesion at high temperatures. While advanced thin film TC technology provides minimally intrusive surface temperature measurement and has good adhesion on the CMC, its fabrication requires sophisticated and expensive facilities and is very time consuming. In addition, the durability of lead wire attachments to both thin film TC's and the substrate materials requires further improvement. This paper presents a newly developed attachment technique for installation of free filament wire TC's with a unique convoluted design on ceramic based materials such as CMC's. Three CMC's (SiC/SiC CMC and alumina/alumina CMC) instrumented with type IC, R or S wire TC's were tested in a Mach 0.3 burner rig. The CMC temperatures measured from these wire TC's were compared to that from the facility pyrometer and thin film TC's. There was no sign of TC delamination even after several hours exposure to 1200 C. The test results proved that this new technique can successfully attach wire TC's on CMC's and provide temperature data in hostile environments. The sensor fabrication process is less expensive and requires very little time compared to that of the thin film TC's. The same installation technique/process can also be applied to attach lead wires for thin film sensor systems.

Lei, Jih-Fen↗

NASA NTRS1997

Advances in Thin Film Sensor Technologies for Engine Applications

Advanced thin film sensor techniques that can provide accurate surface strain and temperature measurements are being developed at NASA Lewis Research Center. These sensors are needed to provide minimally intrusive characterization of advanced materials (such as ceramics and composites) and structures (such as components for Space Shuttle Main Engine, High Speed Civil Transport, Advanced Subsonic Transports and General Aviation Aircraft) in hostile, high-temperature environments and for validation of design codes. This paper presents two advanced thin film sensor technologies: strain gauges and thermocouples. These sensors are sputter deposited directly onto the test articles and are only a few micrometers thick; the surface of the test article is not structurally altered and there is minimal disturbance of the gas flow over the surface. The strain gauges are palladium-13% chromium based and the thermocouples are platinum-13% rhodium vs. platinum. The fabrication techniques of these thin film sensors in a class 1000 cleanroom at the NASA Lewis Research Center are described. Their demonstration on a variety of engine materials, including superalloys, ceramics and advanced ceramic matrix composites, in several hostile, high-temperature test environments are discussed.

Lei, Jih-Fen↗

NASA NTRS1996

High-temperature Strain Sensor and Mounting Development

This report describes Government Work Package Task 29 (GWP29), whose purpose was to develop advanced strain gage technology in support of the National Aerospace Plane (NASP) Program. The focus was on advanced resistance strain gages with a temperature range from room temperature to 2000 F (1095 C) and on methods for reliably attaching these gages to the various materials anticipated for use in the NASP program. Because the NASP program required first-cycle data, the installed gages were not prestabilized or heat treated on the test coupons before first-cycle data were recorded. NASA Lewis Research Center, the lead center for GWP29, continued its development of the palladium-chromium gage; NASA Langley Research Center investigated a new concept gage using Kanthal A1; and the NASA Dryden Flight Research Center chose the well-known BCL-3 iron-chromium-aluminum gage. Each center then tested all three gages. The parameters investigated were apparent strain, drift strain, and gage factor as a function of temperature, plus gage size and survival rate over the test period. Although a significant effort was made to minimize the differences in test equipment between the three test sites (e.g., the same hardware and software were used for final data processing), the center employed different data acquisition systems and furnace configurations so that some inherent differences may be evident in the final results.

Williams, W. Dan↗

NASA NTRS1995

Evaluation of Pd-Cr Wires for Strain Gage Application

A newly developed alloy, palladium-13 weight percent chromium (Pd13Cr), was identified by United Technologies Research Center under a NASA contract to be the best material for high temperature strain gage applications. An electrical resistance strain gage that can provide accurate static strain measurement to a temperature higher than that of a commercially available gage is urgently needed in aerospace and aeronautics research. A strain gage made of a 25.4 micron (1 mil) diameter Pd13Cr wire has been recently demonstrated to be usable for static strain measurements to 800 C. This compares to the 400 C temperature limit of the commercially available strain gages. The performance of the Pd-Cr gage, however, strongly depends on the quality of the Pd13Cr wire. Four batches of Pd-Cr wires purchased from three different manufacturers were therefore evaluated to determine the best source of the wire for strain gage applications. The three suppliers were Precious Metal Institute in China, Sigmund Cohn Co., and G & S Titanium, Inc. in the United States. Two batches of wires obtained from Previous Metal Institute in 1987 and 1992, respectively are referred to herein as China87 and China92 wires. The mechanical, chemical and electrical properties of these wires, both as-received and after high temperature exposures at 800 C for 50 hours were analyzed. The elastic modulus and the failure strength of the wires were evaluated using a tensile test machine equipped with a laser speckle strain measurement system. The chemical and microstructural properties of the wires were inspected using a plasma atomic emission spectrometer and a scanning electron microscope (SEM) equipped with an energy dispersive X-ray spectroscope (EDS). The electrical stability and repeatability of the wires were determined by measuring the electrical resistance of the wires during three thermal cycles to 1000 C and a ten-hour soak at 1000 C. As a result of this study, the wire which has the highest strength, the least impurities content, the best oxidation resistance and the best electrical stability will be selected for upcoming strain gage applications.

Lei, Jih-Fen↗

NASA NTRS1994

More About High-Temperature Resistance Strain Gauges

Two reports present additional information on electrical-resistance strain gauges described in "High-Temperature Resistance Strain Gauges" (LEW-15379). For protection against oxidation at high temperatures, gauges covered, by flame spraying, with coats of alumina containing up to 1 weight percent of yttria or, perferably, containing 4 to 6 weight percent of zirconia.

Englund, D. R.↗

NASA NTRS1994

High-Temperature Resistance Strain Gauges

Resistance strain gauges developed for use at high temperatures in demanding applications like testing aircraft engines and structures. Measures static strains at temperatures up to 800 degrees C. Small and highly reproducible. Readings corrected for temperature within small tolerances, provided temperatures measured simultaneously by thermocouples or other suitable devices. Connected in wheatstone bridge.

Lei, Jih-Fen↗

NASA NTRS1993

High temperature strain measurement with a resistance strain gage

A PdCr based electrical resistance strain gage was demonstrated in the laboratory to be a viable sensor candidate for static strain measurement at high temperatures. However, difficulties were encountered while transferring the sensor to field applications. This paper is therefore prepared for recognition and resolution of the problems likely to be encountered with PdCr strain gages in field applications. Errors caused by the measurement system, installation technique and lead wire attachment are discussed. The limitations and some considerations related to the temperature compensation technique used for this gage are also addressed.

Lei, Jih-Fen↗

NASA NTRS1993

Protective Coats For High-Temperature Strain Gauges

Addition of some rare-earth oxides to prior alumina (only) coating material increases maximum service temperature of palladium/chromium-wire strain gauges. Pd/Cr wires used at temperatures up to 800 degrees C without excessive drift in electrical resistance. Oxides used: zirconia (ZrO2), yttria (Y2O3), ceria (CeO2), and hafnia (HfO2). Addition of one of these oxides to decrease oxidation of wire at high temperature. Protection against oxidation increases with concentration of rare-earth oxide. Addition of ZrO2 at 4 to 6 weight percent or Y2O3 at 1 weight percent results in smallest drift in electrical resistance.

Lei, Jih-Fen↗

NASA NTRS1992

High temperature static strain measurement with an electrical resistance strain gage

An electrical resistance strain gage that can supply accurate static strain measurement for NASP application is being developed both in thin film and fine wire forms. This gage is designed to compensate for temperature effects on substrate materials with a wide range of thermal expansion coefficients. Some experimental results of the wire gage tested on one of the NASP structure materials, i.e., titanium matrix composites, are presented.

Lei, Jih-Fen↗

NASA NTRS1992

Pd/Cr Strain Gauges For High Temperatures

Temperature-compensated Pd/Cr electrical-resistance strain gauges measure static strains in combustors, blades, and vanes of gas turbine engines. Made of alloy of 87 weight percent Pd and 13 weight percent Cr. Microstructure highly stable; undergoes no transformation of phase between ambient temperature and 1,000 degrees C. Gives highly repeatable readings with low drift at temperatures from ambient to 600 degrees C.

Lei, Jih-Fen↗