Effect of solvent type on Nafion solubility parameters, solution rheological behavior, coating deposition and drying
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Engineering topics
Publications and source records attributed to Linde, Carl Erik.
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Polymer oxidation is usually accelerated with temperature, which is therefore applied in nearly every experimental approach dealing with predictive materials aging. Because of this simple approach, we may tend to neglect that the effective concentration of oxygen also acts as a rate multiplier for oxidation. Increasing the oxygen partial pressure in an aging environment accelerates oxidation, and while there is often a near proportional increase initially, the effect of additional oxygen usually transitions to a saturation level at some elevated pressure. This has been theoretically described in the general autoxidation scheme and is well recognized. However, for many materials the exact rate behavior under moderately increased oxygen concentration remains to be established. We therefore review epoxy oxidation and offer a broader overview of its behavior under increased O 2 partial pressure. Experimental data are given for a few thermoset materials demonstrating their rate behavior under O 2 partial pressure up to 4 atm, meaning approximately 20 times more than under standard atmospheric conditions. Confirmative evidence suggests that epoxy materials will reach saturation oxidation rates only at significantly higher O 2 partial pressure. In such a high-pressure regime it is theoretically possible to not only accelerate oxidation, but to transition into a condition where O 2 diffusion can be increased without further accelerating the oxidation rate. Finally, this can reduce diffusion limited oxidation effects under specific accelerated aging conditions as a combination of temperature and O 2 partial pressure.
Direct ink write (DIW) printing of reactive resins presents a unique challenge due to the time-dependent nature of the rheological and chemical properties of the ink. As a result, careful print optimization or process control is important to obtain consistent, high quality prints. The present invention uses a flow-through characterization cell for in situ chemical monitoring of a resin ink during DIW printing. Additionally, in-line extrusion force monitoring can be combined with off-line post inspection using machine vision. By combining in-line spectroscopy and force monitoring, it is possible to follow reaction kinetics (for example, curing of a reactive resin) and viscosity changes during printing, which can be used for a closed-loop process control. Additionally, the capability of machine vision to automatically identify and quantify print artifacts can be incorporated on the printing line to enable real-time, AI-assisted quality control of the printed products. Together, these techniques can form the building blocks of an optimized process control strategy when complex reactive ink must be used to produce printed hardware.
Material extrusion printing of reactive resins and inks present a unique challenge due to the time-dependent nature of the rheological and chemical properties they possess. As a result, careful print optimization or process control is important to obtain consistent, high quality prints via additive manufacturing. Here, we present the design and use of a near-infrared (NIR) flow through cell for in situ chemical monitoring of reactive resins during printing. Differences between in situ and off-line benchtop measurements are presented and highlight the need for in-line monitoring capability. Additionally, in-line extrusion force monitoring and off-line post inspection using machine vision is demonstrated. By combining NIR and extrusion force monitoring, it is possible to follow cure reaction kinetics and viscosity changes during printing. When combined with machine vision, the ability to automatically identify and quantify print artifacts can be incorporated on the printing line to enable real-time, artificial intelligence-assisted quality control of both process and product. Together, these techniques form the building blocks of an optimized closed-loop process control strategy when complex reactive inks must be used to produce printed hardware.