Electromigration issues in state-of-the art and emerging metallization systems
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tungsten vias copper metallization microinductors ↗
Engineering topics
Lloyd, J. R.
Publications and source records attributed to Lloyd, J. R..
Effects of via-conductor geometry in the electromigration failure of Al:Cu wires
Electromigration (EM) experiments conducted using two types of via/plug to conductor alignment indicate a geometrical dependence of electromigration failure in Al:Cu conductors. The resistance vs time curves show distinctive steps when the alignment is parallel. This is explained by a successive loss of conductivity through the plug due to void formation. In the perpendicular via/conductor arrangement, resistance increases by smaller and closely spaced steps. EM experiments without vias, found that the conductor life under stress increases by at least an order of magnitude. Kinetic studies at four temperatures between 180-240 C found activation energies to be 1.0 plus or minus 0.1eV.
Al:Cu accelerated testing electromigration activat↗
Study of 'ratio' automatically assembled structures final report, 15 jun. 1963 - 15 jun. 1964
Structural analysis of RATIO automatically assembled panel sections for application to spaceborne paraboloidal antenna
STRUCTURAL ENGINEERING↗