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Lynch, Bernard A.

Publications and source records attributed to Lynch, Bernard A..

Silicon Microleaks for Inlets of Mass Spectrometers

Microleaks for inlets of mass spectrometers used to analyze atmospheric gases can be fabricated in silicon wafers by means of photolithography, etching, and other techniques that are commonly used in the manufacture of integrated circuits and microelectromechanical systems. The microleaks serve to limit the flows of the gases into the mass-spectrometer vacuums to specified very small flow rates consistent with the capacities of the spectrometer vacuum pumps. There is a need to be able to precisely tailor the dimensions of each microleak so as to tailor its conductance to a precise low value. (As used here, "conductance" signifies the ratio between the rate of flow in the leak and the pressure drop from the upstream to the downstream end of the leak.) To date, microleaks have been made, variously, of crimped metal tubes, pulled glass tubes, or frits. Crimped-metal and pulled-glass-tube microleaks cannot readily be fabricated repeatably to precise dimensions and are susceptible to clogging with droplets or particles. Frits tend to be differentially chemically reactive with various gas constituents and, hence, to distort the gas mixtures to be analyzed. The present approach involving microfabrication in silicon largely overcomes the disadvantages of the prior approaches.

Harpold, Dan↗

Performance of a Carbon Nanotube Field Emission Electron Gun

A cold cathode field emission electron gun (e-gun) based on a patterned carbon nanotube (CNT) film has been fabricated for use in a miniaturized reflectron time-of-flight mass spectrometer (RTOF MS). Performance of the CNT e-gun has been evaluated. A traditional thermionic electron gun has also been fabricated and evaluated in parallel and its performance is used as a benchmark in the evaluation of our CNT e-gun. Implications for future improvements and integration into the RTOF MS are discussed.

Getty, Stephanie A.↗

Fabrication of MEMS-Based Microshutter Arrays for Optical Transmission Selection

A MEMS-based programmable aperture mask is under development at the NASA Goddard Space Flight Center. Termed the Microshutter (u-shutter) Array, the device will be used to control the transmission of light, with both high efficiency and contrast, to a multi-object spectrometer on the James Webb Space Telescope. Fabrication of the p-shutter array employs several novel designs and processing techniques. The current generation of micro-shutters consists of 128x64 pixel arrays with unit cell dimensions of 100x200 microns. Shutters are patterned in silicon nitride and sit on a 100 micron silicon frame that is DRIE etched below each shutter. The front and back sides of the device are shown. A magnetic cobalt-iron alloy patterned on top of the shutter allows it to be actuated 90 degrees out-of-plane, into the frame, by an external magnetic field. An electrode on the shutter and a vertical electrode on the sidewall of the frame, approximately 90pm deep, allow them to be electrostatically latched in their rotated position. The vertical electrode is deposited and patterned on the backside of the frame in a single step using a directionally controlled evaporation. Individual addressing of shutters for electrostatic latching is accomplished via a crosspoint addressing scheme, with no on-chip active components. A portion of an array with shutters in the open, latched, and closed positions is shown. Light loss at shutter edges is minimized by an overhanging aluminum light-shield that is anchored to the frame. A photoresist sacrificial layer is used to raise the light-shield up and over the 2 micron gap that surrounds each pixel. After completion, arrays are subjected to life cycle, environmental and optical testing. Fabricated devices have survived 10(exp 6) actuation cycles at both room and cryogenic temperatures and a 14g rms launch-simulation test. Optical testing has shown contrast measurements between open and closed shutters up to 10000:1.

Lynch, Bernard A.↗