Development of beam leaded low power logic circuits
The technologies of low power TTL and beam lead processing were merged into a single product family. This family offers the power and thermal advantages of low power(54L), while providing the additional reliability advantages of beam leads. The reduction in the power and heat levels also allows the system designer to take advantage, through beam lead, multichip assemblies, of increased package density to reduce system size and weight.
Smith, B. W.↗