Engineering topics
Publications and source records attributed to Mantooth, A..
A new NanoTCAD-to-Spectre interface is applied to perform mixed-mode SEU simulations of an SRAM cell. Results using newly calibrated TCAD cold temperature substrate mobility models, and BSIM3 compact models extracted explicitly for the cold temperature designs, indicate a 33% reduction in SEU threshold for the range of temperatures simulated.
An improved charge pump that utilizes a MOSFET body diode as a charge transfer switch is discussed.
The NASA roadmap outlining future deep space missions to Europa and other outer planetary destinations calls for continued reductions in the mass and volume of the spacecraft avionics. Spacecraft power electronics, including the power switches and converters, remain difficult to miniaturize due to the need for large numbers of discrete passive components such as resistors, capacitors, inductors and transformers. As part of the System-on-a-chip program at the Center for Integrated Space Microsystems and at the University of Arkansas, we are working to develop integrated or embedded passive components geared specifically for use in power management and distribution (PMAD) in future avionics over the next five to ten years. This will not only enable a scaling down of the power subsystems, but will make possible new architectures such as "distributed" PMAD. Additional information is contained in the original extended abstract.
Mixed mode rad hard avionics Systems on a Chip (SoC) designed for deep space applications such as Europa orbiters and Europa Landers will require data isolation circuits to block noise. This paper presents the simulation performance for a novel rad hard SOI CMOS compatible thermal transducer used for on-chip data isolation in SoC. The research presented involves the use of commercially available computer aided design tools to model the transient electrothermal behavior of the transducer. Both one- and two-dimensional analyses of a prototype thermal transducer were performed. Results indicate that thermal-based data isolator technology can pass a data bit in under a microsecond and, as a measurement of feasibility, I(exp 2)C bus specifications can be met.