An Overview of Cyber-Resilient Smart Inverters Based on Practical Attack Models
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97 MATHEMATICS AND COMPUTING↗
Engineering topics
Mantooth, H. Alan
Publications and source records attributed to Mantooth, H. Alan.
Chapter 32 - Power Grid Resilience
The new energy paradigm is altering the current power grid trend from synchronous generator reliant system toward power-electronics-based distributed energy resources (DERs). The resilient operation of modern power grid is highly dependent upon cyber and physical reliable operation of DERs. Power grid resilience broadly refers to the ability of the grid to be robust to eventualities and singularities that may disrupt the continuity of reliable power flow. This could involve resilience related to the physical system but more recently, the focus on cyber resilience has been evolving rapidly especially given the burgeoning growth of distributed generation and power-electronics-based DERs under smart grid and given that such threats to reliable operation do not have to evolve localized to where the physical asset is. Commonly, in power grids dominated by DERS, control and energy management are structured at a multitime scale multilayer fashion: (i) primary control layer at microseconds time scale, (ii) secondary control layer at millisecond time scale, and (iii) tertiary control layer at seconds to minutes time scale. The cyber-related issues that may affect the power grid resilience can be introduced in through primary, secondary, and tertiary control layers. The failure of each of these control layers may impact the reliable and resilient operation of the overall network and cause widespread failures which leads to unintended blackouts. As such, this chapter focuses on cyber-related resilience issues in primary control layer, secondary control layer, tertiary control layer, wide area/utility control, and anomaly detection and resilient communication.
anomaly detection↗
Broad Frequency LTCC Vertical Interconnect Transition for Multichip Modules and System on Package Applications
Various stripline structures and flip chip interconnect designs for high-speed digital communication systems implemented in low temperature co-fired ceramic (LTCC) substrates are studied in this paper. Specifically, two different transition designs from edge launch 2.4 millimeter connectors to stripline transmission lines embedded in LTCC are discussed. After characterizing the DuPont (sup trademark) 9K7 green tape, different designs are proposed to improve signal integrity for high-speed digital data. The full-wave simulations and experimental data validate the presented designs over a broad frequency band from Direct Current to 50 gigahertz and beyond.
Full-tape-thickness feature; LTCC 9K7 interconnect↗