Advances in Reliability Monitoring and Failure Analysis in 3D Microsystems
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Jordan, Matthew↗
Engineering topics
McDow, Jessica
Publications and source records attributed to McDow, Jessica.
Optimization of Copper Electrodeposition in High Aspect Ratio Through Silicon Vias
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McDow, Jessica↗
Performance of Copper Filled Through Glass Vias for RF Applications
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McDow, Jessica↗
High Performance 2.5D interposer for RF Applications
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Jordan, Matthew↗
Copper Electrodeposition in High Aspect Ratio Through Silicon Vias: Wafer Level Plating and Further Processing [Slides]
The goal of this work is to develop a wafer level copper electrochemical deposition process for high aspect ratio through silicon vias and test the reliability and functionality of TSVs for integration into MEMS applications.
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CH↗