Investigation of multilayer printed circuit board materials
Fabrication and environmental tests of circuit boards with polyimide plastic dielectrics and pyrolyzed polyacrylonitrile conductors
Meinhard, J. E.↗
Engineering topics
Meinhard, J. E.
Publications and source records attributed to Meinhard, J. E..
Investigation of Multilayer Printed Circuit Board Materials Final Report
Materials compatibility study for improved multilayer printed circuit board
Meinhard, J. E.↗
Process techniques study of integrated circuits Quarterly report no. 11
Dielectric defects in oxide layers by ion migration, and hydrogen effects on integrated circuits with packaging considerations
Meinhard, J. E.↗
Process techniques study of integrated circuits Quarterly report no. 13
Dielectric defects in oxide layers by surface irregularities, and treatment
Meinhard, J. E.↗
Process techniques study of integrated circuits Interim scientific report no. 1
Advanced processing techniques for fabricating high reliability silicon integrated circuits, and failure mode studies
Meinhard, J. E.↗
Thermal and bias cycling stabilizes planar silicon devices
Terminal burn-in or baking step time in the processing of planar silicon devices is extended to reduce their inversion tendencies. The collector-base junction of the device is also cyclically biased during the burn-in.
Harris, R. E.↗
Process techniques study of integrated circuits Quarterly report no. 4
Processing techniques of integrated circuits
INTEGRATED CIRCUIT↗
Process techniques study of integrated circuits Quarterly report no. 3
Processing techniques of integrated circuits
INTEGRATED CIRCUIT↗