Microminiature solid-state imaging system utilizing hybrid LSI techniques
Microminiature solid state LSI imaging system design, construction and performance characteristics
Anders, R. A.↗
Engineering topics
Mend, W. G.
Publications and source records attributed to Mend, W. G..
A 50 x 80 solid state imaging system utilizing hybrid LSI techniques
Production engineering and electrical operation of phototransistor sensing array system and display device including large scale integration and logic circuitry
Anders, R. A.↗
Multichip packaging with thermal insulation
Thermal insulation technique permits low and high power electronic chips to operate in the same package without thermal cross-coupling. An alumina glass shield thermally isolates the low power chip from the high power chip while Kovar substrate acts as a heat sink to remove heat from the high power chip.
Mc Inturff, R. G.↗