The Impact of Transition-Edge Sensor Design on Internal Thermal Fluctuation Noise and Thermal Conductance
The measured noise in transition-edge sensor (TES) microcalorimeters with a Mo/Au bilayer has been shown to have a significant contribution from internal thermal fluctuation noise (ITFN) between the absorber and the TES. Previous measurements showed the relevant thermal link leading to the noise was the thermal conductance of the TES bilayer, and ITFN has been shown to correlate with the sheet resistance of the TES. As a result, ITFN is particularly significant in devices with a large bilayer sheet resistance. However, because of more favorable transition shapes, such high resistance devices have recently been shown to be preferable under alternating current bias, which is required for the frequency division multiplexed readout baselined for the X-ray Integral Field Unit (X-IFU) instrument on the ATHENA satellite. Therefore, it is important to investigate how else to minimize the ITFN beyond changes to the sheet resistance. In this presentation, we will discuss our investigation of how changes to the TES design can affect ITFN for a fixed sheet resistance. We will present how ITFN is altered by changes to the aspect ratio of the TES, the addition of normal metal banks parallel to the TES current direction, and the size and position of the connections between the absorber and the TES. We will also discuss how these design changes impact the superconducting transition shape, and the thermal conductance from the TES to the thermal bath. These results may provide routes for further improvements of TES performance, and a deeper understanding of the physics of the thermal network in a TES microcalorimeter.