Engineering topics

Michal, Gary M.

Publications and source records attributed to Michal, Gary M..

9 records

NASA NTRS1999

Monolithic Cu-Cr-Nb Alloys for High Temperature, High Heat Flux Applications

Work during the prior four years of this grant has resulted in significant advances in the development of Cu-8 Cr4 Nb and related Cu-Cr-Nb alloys. The alloys are nearing commercial use in the Reusable Launch Vehicle (RLV) where they are candidate materials for the thrust cell liners of the aerospike engines being developed by Rocketdyne. During the fifth and final year of the grant, it is proposed to complete development of the design level database of mechanical and thermophysical properties and transfer it to NASA Glenn Research Center and Rocketdyne. The database development work will be divided into three main areas: Thermophysical Database Augmentation, Mechanical Testing and Metallography and Fractography. In addition to the database development, work will continue that is focussed on the production of alternatives to the powder metallurgy alloys currently used. Exploration of alternative alloys will be aimed at both the development of lower cost materials and higher performance materials. A key element of this effort will be the use of Thermo-Calc software to survey the solubility behavior of a wide range of alloying elements in a copper matrix. The ultimate goals would be to define suitable alloy compositions and processing routes to produce thin sheets of the material at either a lower cost, or, with improved mechanical and thermal properties compared to the current Cu-Cr-Nb powder metallurgy alloys.

Ellis, David L.↗

NASA NTRS1996

Mechanical and Thermal Properties of Two Cu-Cr-Nb Alloys and NARloy-Z

A series of creep tests were conducted on Cu-8 Cr-4 Nb (Cu-8 at.% Cr-4 at.% Nb), Cu-4 Cr-2 Nb (Cu-4 at.% Cr-2 at% Nb), and NARloy-Z (Cu-3 wt.% Ag-0.5 wt.% Zr) samples to determine their creep properties. In addition, a limited number of low cycle fatigue and thermal conductivity tests were conducted. The Cu-Cr-Nb alloys showed a clear advantage in creep life and sustainable load over the currently used NARloy-Z. Increases in life at a given stress were between 100% and 250% greater for the Cu-Cr-Nb alloys depending on the stress and temperature. For a given life, the Cu-Cr-Nb alloys could support a stress between 60% and 160% greater than NARloy-Z. Low cycle fatigue lives of the Cu-8 Cr-4 Nb alloy were equivalent to NARloy-Z at room temperature. At elevated temperatures (538 C and 650 C), the fatigue lives were 50% to 200% longer than NARloy-Z samples tested at 538 C. The thermal conductivities of the Cu-Cr-Nb alloys remained high, but were lower than NARloy-Z and pure Cu. The Cu-Cr-Nb thermal conductivities were between 72% and 96% that of pure Cu with the Cu-4 Cr-2 Nb alloy having a significant advantage in thermal conductivity over Cu-8 Cr4 Nb. In comparison, stainless steels with equivalent strengths would have thermal conductivities less than 25% the thermal conductivity of pure Cu. The combined results indicate that the Cu-Cr-Nb alloys offer an attractive alternative to current high temperature Cu-based alloys such as NARloy-Z.

Ellis, David L.↗

NASA NTRS1993

Reaction layer formation at the graphite/copper-chromium alloy interface

Sessile drop tests were used to obtain information about copper chromium alloys that suitably wet graphite. Characterization of graphite/copper-chromium alloy interfaces subjected to elevated temperatures were conducted using scanning electron micrography, energy dispersive spectroscopy, Auger electron spectroscopy, and X-ray diffraction analyses. These analyses indicate that during sessile drop tests conducted at 1130 C for one hour, copper alloys containing greater than 0.98 percent chromium form continuous reaction layers of approximately 10 micron thickness. The reaction layers adhere to the graphite surface. The copper wets the reaction layer to form a contact angle of 60 degrees or less. X-ray diffraction results indicate that the reaction layer is chromium carbide. The kinetics of reaction layer formation were modelled in terms of bulk diffusion mechanisms. Reaction layer thickness is controlled initially by the diffusion of Cr out of Cu alloy and later by the diffusion of C through chromium carbide.

Devincent, Sandra M.↗

NASA NTRS1992

Reaction layer formation at the graphite/copper-chromium alloy interface

Sessile drop tests were used to obtain information about copper chromium alloys that suitably wet graphite. Characterization of graphite/copper-chromium alloy interfaces subjected to elevated temperatures were conducted using scanning electron micrography, energy dispersive spectroscopy, auger electron spectroscopy, and x ray diffraction analyses. These analyses indicate that during sessile drop tests conducted at 1130 C for one hour, copper alloys containing greater than 0.98 percent chromium form continuous reaction layers of approximately 10 micron thickness. The reaction layers adhere to the graphite surface. The copper wets the reaction layer to form a contact angle of 60 degrees or less. X ray diffraction results indicate that the reaction layer is chromium carbide. The kinetics of reaction layer formation were modelled in terms of bulk diffusion mechanisms. Reaction layer thickness is controlled initially by the diffusion of Cr out of Cu alloy and later by the diffusion of C through chromium carbide.

Devincent, Sandra M.↗

NASA NTRS1991

Graphite/copper alloy interfacial energies determined using the sessile drop method

Graphite surfaces are not wet by pure copper. This lack of wetting is responsible for a debonding phenomenon that was found in continuous graphite fiber/copper matrix composites materials subjected to elevated temperatures. By suitably alloying copper, its capability to wet graphite surfaces can be enhanced. In situ measurements of graphite/copper alloy wetting angles were made using the sessile drop method. Interfacial energy values were calculated based upon these measurements.

Devincent, Sandra M.↗

NASA NTRS1991

Fracture toughness and the effects of stress state on fracture of nickel aluminides

The effects of stress state on the fracture behavior of Ni3Al, Ni3Al + B, and NiAl were determined using either notched or fatigue-precracked bend bars tested to failure at room temperature, in addition to testing specimens in tension under superposed hydrostatic pressure. Although Ni3Al is observed to fail in a macroscopically brittle intergranular manner in tension tests conducted at room temperature, the fracture toughnesses presently obtained on Ni3Al exceeded 20 MPam, and R-curve behavior was exhibited. In situ monitoring of the fracture experiments was utilized to aid in interpreting the source(s) of the high toughness in Ni3Al, while SEM fractography was utilized to determine the operative fracture modes. The superposition by hydrostatic pressure during tensile testing of NiAl specimens was observed to produce increased ductility without changing the fracture mode.

Lewandowski, John J.↗

NASA NTRS1990

Production and processing of Cu-Cr-Nb alloys

A new Cu-based alloy possessing high strength, high conductivity, and good stability at elevated temperatures was recently produced. This paper details the melting of the master alloys, production of rapidly solidified ribbon, and processing of the ribbon to sheet by hot pressing and hot rolling.

Ellis, David L.↗

NASA NTRS1990

Production and processing of Cu-Cr-Nb alloys

Ellis, David L.↗

NASA NTRS1989

Precipitation strengthened high strength, high conductivity Cu-Cr-Nb alloys produced by chill block melt spinning

A series of Cu-based alloys containing 2 to 10 a/o Cr and 1 to 5 a/o Nb were produced by chill block melt spinning (CBMS). The melt spun ribbons were consolidated and hot rolled to sheet to produce a supersaturated Cu-Cr-Nb solid solution from which the high melting point intermetallic compound Cr2Nb could be precipitated to strengthen the Cu matrix. The results show that the materials possess electrical conductivities in excess of 90 percent that of pure Cu at 200 C and above. The strengths of the Cu-Cr-Nb alloys were much greater than Cu, Cu-0.6 Cr, NARloy-A, and NARloy-Z in the as-melt spun condition. The strengths of the consolidated materials were less than Cu-Cr and Cu-Cr-Zr below 500 C and 600 C respectively, but were significantly better above these temperatures. The strengths of the consolidated materials were greater than NARloy-Z, at all temperatures. The GLIDCOP possessed similar strength levels up to 750 C when the strength of the Cu-Cr-Nb alloys begins to degrade. The long term stability of the Cu-Cr-Nb alloys was measured by the microhardness of aged samples and the growth of precipitates. The microhardness measurements indicate that the alloys overage rapidly, but do not suffer much loss in strength between 10 and 100 hours which confirms the results of the electrical resistivity measurements taken during the aging of the alloys at 500 C. The loss in strength from peak strength levels is significant, but the strength remains exceptionally good. Transmission electron microscopy (TEM) of the as-melt spun samples revealed that Cr2Nb precipitates formed in the liquid Cu during the chill block melt spinning, indicating a very strong driving force for the formation of the precipitates. The TEM of the aged and consolidated materials indicates that the precipitates coarsen considerably, but remain in the submicron range.

Ellis, David L.↗