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Moore, R. L.

Publications and source records attributed to Moore, R. L..

136 records · Page 8

The structure and heating of the chromosphere-corona transition region

The structure and heating (or energy balance) of the transition region and the role of the transition region in the structure and heating of the solar atmosphere as a whole are investigated. The features of the structure of the atmosphere and radiative energy losses of the atmosphere are summarized. A static, planar model of the solar temperature which has a temperature profile representative of the actual solar atmosphere is considered. Then a static, planar model of the transition region which is heated by thermal conduction from the corona and cooled by radiative losses is developed. A general conclusion is that the temperature profile of the transition region and lower corona results primarily from the energy balance of the corona, while the number density is determined by the energy balance of the transition region.

Moore, R. L.↗

Structure of the chromosphere-corona transition region.

The structure and energy balance of the chromosphere-corona transition region is investigated by means of a static, planar model which is compared with the results of XUV-resonance-line observations. In this model, the transition region is heated by thermal conduction from the corona and cooled by radiative losses. Comparison of the model with observational results implies that this is the dominant process in the energy balance of the transition region, and that the base of the transition region is inherently nonstatic and/or nonplanar. The model explains the observational finding of Noyes et al. (1970) that the number density and the downward heat flux both increase by the same factor from quiet regions to active regions.

Moore, R. L.↗

Investigation of the development of cracks in solder joints

Study consisted of an analytical approach, in which a mathematical model of existing printed circuit board component mounting techniques was analyzed, and an empirical investigation was performed to determine the extent of damage caused by temperature cycling of the printed circuit boards.

Moore, R. L.↗