Test Plan to Investigate the Optimal Cure Schedule of an Epoxy Resin for Its Application as an Adhesive in Optocouplers
Epoxy resins are polymeric materials that are known for their versatility, low cost, and strong thermal and mechanical properties. They can be used as coatings, adhesives, automotive primers, and have become staples in electronics, aerospace composites and semiconductor encapsulates. Recently, LANL has experienced a decline in the quality of a specialized electronic device, called an optocoupler, which is normally acquired from commercial suppliers. Because of this, a group at LANL is exploring the feasibility of in-house manufacturing of an optocoupler that is better suited for their application. The current prototype has resulted in adhesive failure after being exposed to several thermal cycles. There is a need to investigate the possible reasons for this failure, particularly how the cure schedule of the epoxy might affect its adhesive strength over time and in cycled temperatures. To assist in this investigation, a test plan has been developed involving multiple experiments using thermomechanical analysis (TMA), dynamic mechanical analysis (DMA) and differential scanning calorimetry (DSC).