Thermal stress analysis of epoxy encapsulants.
Thermal stress analysis of epoxy encapsulants using mathematical model for predicting performance in thermal shock
EPOXY RESIN↗
Engineering topics
Nikolaychik, G.
Publications and source records attributed to Nikolaychik, G..
Bending-stiffness Properties of a Prestressed Segmented Ceramic Plate
Bending, twisting, and Poisson stiffness of prestressed segmented ceramic plate
POISSON RATIO↗