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Orloff, Jon

Publications and source records attributed to Orloff, Jon.

Fracture Tests of Etched Components Using a Focused Ion Beam Machine

Many optical MEMS device designs involve large arrays of thin (0.5 to 1 micron components subjected to high stresses due to cyclic loading. These devices are fabricated from a variety of materials, and the properties strongly depend on size and processing. Our objective is to develop standard and convenient test methods that can be used to measure the properties of large numbers of witness samples, for every device we build. In this work we explore a variety of fracture test configurations for 0.5 micron thick silicon nitride membranes machined using the Reactive Ion Etching (RIE) process. Testing was completed using an FEI 620 dual focused ion beam milling machine. Static loads were applied using a probe. and dynamic loads were applied through a piezo-electric stack mounted at the base of the probe. Results from the tests are presented and compared, and application for predicting fracture probability of large arrays of devices are considered.

Kuhn, Jonathan, L.↗

Fracture Probability of MEMS Optical Devices for Space Flight Applications

A bending fracture test specimen design is presented for thin elements used in optical devices for space flight applications. The specimen design is insensitive to load position, avoids end effect complications, and can be used to measure strength of membranes less than 2 microns thick. The theoretical equations predicting stress at failure are presented, and a detailed finite element model is developed to validate the equations for this application. An experimental procedure using a focused ion beam machine is outlined, and results from preliminary tests of 1.9 microns thick single crystal silicon are presented. These tests are placed in the context of a methodology for the design and evaluation of mission critical devices comprised of large arrays of cells.

Fettig, Rainer K.↗

Some Aspects on the Mechanical Analysis of Micro-Shutters

An array of individually addressable micro-shutters is being designed for spectroscopic applications. Details of the design are presented in a companion paper. The mechanical design of a single shutter element has been completed. This design consists of a shutter blade suspended on a torsion beam manufactured out of single crystal silicon membranes. During operation the shutter blade will be rotated by 90 degrees out of the array plane. Thus, the stability and durability of the beams are crucial for the reliability of the devices. Structures were fabricated using focused ion beam milling in a FEI 620 dual beam machine, and subsequent testing was completed using the same platform. This allowed for short turn around times. We performed torsion and bending experiments to determine key characteristics of the membrane material. Results of measurements on prototype shutters were compared with the predictions of the numerical models. The data from these focused studies were used in conjunction with experiments and numerical models of shutter prototypes to optimize the design. In this work, we present the results of the material studies, and assess the mechanical performance of the resulting design.

Fettig, Rainer K.↗