Plasma-Sprayed Copper Tie-In for Nickel Plating
Foam insulation nickel-plated with one less step. Changing tie-in layer from plasma-sprayed nickel to plasma-sprayed copper eliminates intermediate copper electroplating step previously required.
Engineering topics
Publications and source records attributed to Otousa, J. E..
Foam insulation nickel-plated with one less step. Changing tie-in layer from plasma-sprayed nickel to plasma-sprayed copper eliminates intermediate copper electroplating step previously required.
Electrodeposition used to strengthen welded joints gouged, nicked, or suffered other mechanical damage. Plating cell, typically of acrylic plastic such as poly (Methylmetacrylate), is assembled around part to be plated. Areas not to be plated are masked with plater's tape. Weld area is plated in standard nickel-plating process.
Electrodeposition processes play a key role in the fabrication and in-service performance of the Space Shuttle Main Engine. Applications range from the electroforming of the main combustion chamber to the deposition of high-purity copper or gold for hydrogen embrittlement protection of susceptible materials of construction, or nickel for mechanical protection of foam insulated propellant ducts. Techniques for controlling electrolyte purity, verification of deposit integrity, and deposit profile and thickness are reported. The use of in-situ techniques (cell-plating) for localized plating and repair of damaged substrate materials are summarized.