Engineering topics

Pang, Edward L.

Publications and source records attributed to Pang, Edward L..

2 records

DOE OSTI2023

Heterogeneous microstructural evolution during hydrodynamic penetration of a high-velocity copper microparticle impacting copper

Microparticle hydrodynamic penetration (HDP) may be associated with the erosion regime in cold spray processing and other high-velocity impact events. Here, in an experimental approach where we can individually launch particles and study the impact sites, we explore copper microparticles impacted on copper substrates at velocities above 900 m/s where HDP begins. We lift cross-sectional lamellae from the impact sites with a focused-ion beam for further microstructural characterization using electron backscatter diffraction and scanning transmission electron microscopy. Due to the gradients of strain, strain rate, and temperature associated with HDP, heterogeneous microstructures result. The structural evolution processes observed include deformation twinning and multiple dislocation-mediated grain recrystallization mechanisms—geometric dynamic recrystallization (gDRX), discontinuous DRX (dDRX), and meta DRX (mDRX). The higher strains at the interface lead to the most significant structural changes and complex mechanisms. In contrast, there is a gradient to more conventional dislocation plasticity away from the interface (on either the particle or substrate side). Here, these microstructural observations are consistent with the deformation map for copper and extend the observations of impact-induced recrystallization across new regimes of behavior.

Cold spray process↗

DOE OSTI2021

Oxide layer delamination: An energy dissipation mechanism during high-velocity microparticle impacts

The break-up of microparticle surface oxides is needed to generate a clean metal-metal contact for metallurgical bonding during impact events such as seen in cold-spray. However, the mechanism by which this occurs is not clear. Here, using a laser-induced particle impact tester, we conduct site-specific experiment of single Cu microparticle impacts on a polished Cu substrate and characterize the impact sites. We observe that oxide layers on the particles begin to delaminate at velocities high enough to cause jetting of the substrate around the periphery of the impact site. We show that the energy cost of such delamination is ~30% of the energy needed to slow and stop particle as it bonds to the substrate, with the remainder being associated with the jetting process and bonding itself. At higher velocities, the oxide barrier is broken up to permit metallurgical bonding. Closer to the particle south-pole where hoop strain is low, oxide layers break up with few gaps and thus no metallurgical bonding is observed. Away from the south-pole where larger strains develop, oxide breakup permits intermittent bonding by the extrusion of bare metal into the gaps between oxide islands. These observations provide new insights towards understanding impact-induced metallurgical bonding during cold-spray process.

36 MATERIALS SCIENCE↗