Search NASA⌕ Search

Engineering topics

Plante, Jeannette

Publications and source records attributed to Plante, Jeannette.

At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2022

Assurance Equations: A Cost and Criticality Model for Optimizing Quality Assurance Surveillance

The cost of quality vs cost of failure correction has been a long-running topic of discussion within the Aerospace community. It leads directly to concepts of “risk tolerance”, and risk-based decision-making. It would be valuable if there was a way to compute the optimal investment in customer-executed quality assurance activities using defect significance with respect to performance objectives, the activities’ defect detection effectiveness, and the cost-penalty for late discovery of impactful defects. This optimization is particularly of interest to projects whose budget constraints significantly limit their risk management options.The cost to fix defects (i.e., failure correction) escalates as the project matures. There have been studies attempting to determine the relative cost of fixing defects discovered during various phases of a project life cycle with important implications, all of which suggest growth factors are large. The commonly referred to 1:10:100 rule represents a cost multiplier for repair/rework across the Design to Fab to Test hardware development phases. Cost premiums for QA activities also accumulate when they are treated as mandatory (due to schedule drag) or are performed later than their assigned phase.This paper describes the modeling of development phase -dependencies in the conduct of typical customer-executed quality assurance activities. Our initial modeling encompasses:• Distinct phases of the production lifecycle• Multiple kinds of Defects, each with some a-priori likelihood of being present• Each defect’s impact on performance Objectives for a type of hardware• The cost and efficacy of assurance techniques at detecting such Defects• The costs of fixing those Defects detected in a given phase of the production lifecycleThe model captures assurance activities’ abilities to Detect defects. Upon detection it is assumed that the Defect is immediately fixed. Defects that “escape” detection by some activity may thereafter be detected by a later activity, but by then the cost of fixing the Defect may have escalated. Defects are related to the performance Objectives they would detract from, were those Defects to remain present in the operating system.We have constructed and are exploring, a model that relates the importance of hardware system elements to mission objectives, the impact of types of Defects on those hardware types, the cost of customer-executed assurance activities (i.e., supplier controls) and their effectiveness towards reducing an impactful quality escape, and the cost of Defect correction across production phase. We describe the approach taken to select the key model aspects, why they are relevant to our NASA mission, and our efforts to populate it with relevant and contemporary data. We use a notional example to illustrate model design and function.

Plante, Jeannette↗
NASA NTRS2013

The Value of Workmanship Standards: What we Want, What we Ask For, What we Get

The Workmanship Standards serve to force positive outcomes rather than to depend only on finding and repairing defects. The Workmanship requirements address all avenues that can introduce defects or allow them to exist at the next level of integration: design, materials, processes, process control, screening.

Plante, Jeannette↗
NASA NTRS2010

Evaluation of 3D Plus Packaging Test Structures for NASA Goddard Space Flight Center

Environmental tests were performed on packaging test structures designed and manufactured for ESA and CNES by 3D PLus ELectronics. The design provided circuit elements that acted as thermal, mechanical and moisture sensors. Other design features showed the compatibility of the packaging with chip passives, bare electronic dice and plastic encapsulated microcircuits packaged together in an innovative, stacked multichip module. The NASA GSFC testing augmented long duration testing on the same units carried out by ESA and CNES. The NASA portion demonstrated packaging stability over temperature, in moisture, with voltage stress, in shock and in vibration environments.

Plante, Jeannette↗
NASA NTRS2010

Workmanship Challenges for NASA Mission Hardware

This slide presentation reviews several challenges in workmanship for NASA mission hardware development. Several standards for NASA workmanship exist, that are required for all programs, projects, contracts and subcontracts. These Standards contain our best known methods for avoiding past assembly problems and defects. These best practices may not be available if suppliers are used who are not compliant with them. Compliance includes having certified operators and inspectors. Some examples of problems that have occured from the lack of requirements flow-down to contractors are reviewed. The presentation contains a detailed example of the challenge in regards to The Packaging "Design" Dilemma.

Plante, Jeannette↗
NASA NTRS2008

Guidelines for Reliable DC/DC Converters for Space Use

NESC saw the need to study the persistent failure of DC/DC Converters during ground testing and in flight, motivated investigation of causes and mitigation options. Research indicated misapplication and device quality to be root causes. The study took 20 months. Team included multiple NASA Centers : JPL, JSC, MSFC, GSFC Project Background

Plante, Jeannette↗
NASA NTRS2006

High Power Laser Diode Array Qualification and Guidelines for Space Flight Environments

High-power laser diode arrays (LDAs) are used for a variety of space-based remote sensor laser programs as an energy source for diode-pumped solid-state lasers. LDAs have been flown on NASA missions including MOLA, GLAS and MLA and have continued to be viewed as an important part of the laser-based instrument component suite. There are currently no military or NASA-grade, -specified, or - qualified LDAs available for "off-the-shelf" use by NASA programs. There has also been no prior attempt to define a standard screening and qualification test flow for LDAs for space applications. Initial reliability studies have also produced good results from an optical performance and stability standpoint. Usage experience has shown, howeve that the current designs being offered may be susceptible to catastrophic failures due to their physical construction (packaging) combined with the electro-optical operational modes and the environmental factors of space application. design combined with operational mode was at the root of the failures which have greatly reduced the functionality of the GLAS instrument. The continued need for LDAs for laser-based science instruments and past catastrophic failures of this part type demand examination of LDAs in a manner which enables NASA to select, buy, validate and apply them in a manner which poses as little risk to the success of the mission as possible.

Ott, Melanie N.↗
NASA NTRS2005

Environmental Conditions for Space Flight Hardware: A Survey

Interest in generalization of the physical environment experienced by NASA hardware from the natural Earth environment (on the launch pad), man-made environment on Earth (storage acceptance an d qualification testing), the launch environment, and the space environment, is ed to find commonality among our hardware in an effort to reduce cost and complexity. NASA is entering a period of increase in its number of planetary missions and it is important to understand how our qualification requirements will evolve with and track these new environments. Environmental conditions are described for NASA projects in several ways for the different periods of the mission life cycle. At the beginning, the mission manager defines survivability requirements based on the mission length, orbit, launch date, launch vehicle, and other factors . such as the use of reactor engines. Margins are then applied to these values (temperature extremes, vibration extremes, radiation tolerances, etc,) and a new set of conditions is generalized for design requirements. Mission assurance documents will then assign an additional margin for reliability, and a third set of values is provided for during testing. A fourth set of environmental condition values may evolve intermittently from heritage hardware that has been tested to a level beyond the actual mission requirement. These various sets of environment figures can make it quite confusing and difficult to capture common hardware environmental requirements. Environmental requirement information can be found in a wide variety of places. The most obvious is with the individual projects. We can easily get answers to questions about temperature extremes being used and radiation tolerance goals, but it is more difficult to map the answers to the process that created these requirements: for design, for qualification, and for actual environment with no margin applied. Not everyone assigned to a NASA project may have that kind of insight, as many have only the environmental requirement numbers needed to do their jobs but do not necessarily have a programmatic-level understanding of how all of the environmental requirements fit together.

Plante, Jeannette↗
NASA NTRS2004

Alternative Test Methods for Electronic Parts

It is common practice within NASA to test electronic parts at the manufacturing lot level to demonstrate, statistically, that parts from the lot tested will not fail in service using generic application conditions. The test methods and the generic application conditions used have been developed over the years through cooperation between NASA, DoD, and industry in order to establish a common set of standard practices. These common practices, found in MIL-STD-883, MIL-STD-750, military part specifications, EEE-INST-002, and other guidelines are preferred because they are considered to be effective and repeatable and their results are usually straightforward to interpret. These practices can sometimes be unavailable to some NASA projects due to special application conditions that must be addressed, such as schedule constraints, cost constraints, logistical constraints, or advances in the technology that make the historical standards an inappropriate choice for establishing part performance and reliability. Alternate methods have begun to emerge and to be used by NASA programs to test parts individually or as part of a system, especially when standard lot tests cannot be applied. Four alternate screening methods will be discussed in this paper: Highly accelerated life test (HALT), forward voltage drop tests for evaluating wire-bond integrity, burn-in options during or after highly accelerated stress test (HAST), and board-level qualification.

Plante, Jeannette↗
NASA NTRS2000

ISS Fiber Optic Failure Investigation Root Cause Report

In August of 1999, Boeing Corporation (Boeing) engineers began investigating failures of optical fiber being used on International Space Station flight hardware. Catastrophic failures of the fiber were linked to a defect in the glass fiber. Following several meetings of Boeing and NASA engineers and managers, Boeing created and led an investigation team, which examined the reliability of the cable installed in the U.S. Lab. NASA Goddard Space Flight Center's Components Technologies and Radiation Effects Branch (GSFC) led a team investigating the root cause of the failures. Information was gathered from: regular telecons and other communications with the investigation team, investigative trips to the cable distributor's plant, the cable manufacturing plant and the fiber manufacturing plant (including a review of build records), destructive and non-destructive testing, and expertise supplied by scientists from Dupont, and Lucent-Bell Laboratories. Several theories were established early on which were not able to completely address the destructive physical analysis and experiential evidence. Lucent suggested hydrofluoric acid (HF) etching of the glass and successfully duplicated the "rocket engine" defect. Strength testing coupled with examination of the low strength break sites linked features in the polyimide coating with latent defect sites. The information provided below explains what was learned about the susceptibility of the pre-cabled fiber to failure when cabled as it was for Space Station and the nature of the latent defects.

Leidecker, Henning↗
NASA NTRS2000

Thermal Characterization for a Modular 3-D Multichip Module

NASA Goddard Space Flight Center has designed a high-density modular 3-D multichip module (MCM) for future spaceflight use. This MCM features a complete modular structure, i.e., each stack can be removed from the package without damaging the structure. The interconnection to the PCB is through the Column Grid Array (CGA) technology. Because of its high-density nature, large power dissipation from multiple layers of circuitry is anticipated and CVD diamond films are used in the assembly for heat conduction enhancement. Since each stacked layer dissipates certain amount of heat, designing effective heat conduction paths through each stack and balancing the heat dissipation within each stack for optimal thermal performance become a challenging task. To effectively remove the dissipated heat from the package, extensive thermal analysis has been performed with finite element methods. Through these analyses, we are able to improve the thermal design and increase the total wattage of the package for maximum electrical performance. This paper provides details on the design-oriented thermal analysis and performance enhancement. It also addresses issues relating to contact thermal resistance between the diamond film and the metallic heat conduction paths.

Fan, Mark S.↗