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Polonsky, Andrew

Publications and source records attributed to Polonsky, Andrew.

At least 19 records

pyTriBeam

SAND2025-01899O pyTriBeam is a software tool that creates automated processes for a scanning electron microscope including workflows for 3D serial sectioning dataset collection, high-res image montaging, and support for custom script use. This includes integration for 3D chemical mapping (EDS) and crystallographic (EBSD) data collection with select supported detectors. The application allows end users to setup and run customizable data collection workflows without requiring expertise in programming. Sandia National Laboratories is a multimission laboratory managed and operated by National Technology & Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA0003525.

Hovey, Chad↗

recon3d

SAND2025-00533O recon3d is a software tool that provides automated 3D reconstruction and meshing capabilities. It processes labeled 3D image data from various sources, starting from image stacks, and calculates 3D feature distributions like size, shape, and location. The software also has tools for downscaling rectilinear grid data and creating tetrahedral meshes directly from image data. recon3d can be used by novice users via the command line with a properly formatted configuration file. Sandia National Laboratories is a multimission laboratory managed and operated by National Technology & Engineering Solutions of Sandia, LLC, a wholly owned subsidiary of Honeywell International Inc., for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-NA0003525.

Emery, John↗

ThermoPore: Predicting part porosity based on thermal images using deep learning

Part qualification is often a critical and labor-intensive process in additive manufacturing, particularly in the detection of defects such as porosity, which stands to benefit significantly from advancements in machine learning. We present a deep learning approach for quantifying and localizing ex-situ porosity within Laser Powder Bed Fusion fabricated samples utilizing in-situ thermal image monitoring data. Our goal is to build the real time porosity map of parts based on thermal images acquired during the build. The quantification task builds upon the established Convolutional Neural Network model architecture to predict pore count and the localization task leverages the spatial and temporal attention mechanisms of the novel Video Vision Transformer model to indicate areas of expected porosity. Our model for porosity quantification achieved a R 2 score of 0.57 and our model for porosity localization produced an average Intersection over Union (IoU) score of 0.32 and a maximum of 1.0. This work is setting the foundations of part porosity “Digital Twins” based on additive manufacturing monitoring data and can be applied downstream to reduce time-intensive post-inspection and testing activities during part qualification and certification. In addition, we seek to accelerate the acquisition of crucial insights normally only available through ex-situ part evaluation by means of machine learning analysis of in-situ process monitoring data.

Deep learning↗

Towards engineering the growth morphology of anisotropic bicrystals

Eutectic alloys, such as Pb-free Bi-Sn-Ag or Sn-Ag-Cu, are essential for their low melting points in solder joints but suffer from brittle intermetallic phases, reducing reliability. Traditional solder design relies on equilibrium phase diagrams, often neglecting the kinetic influence of crystalline anisotropy during solidification. This study hypothesizes that the energetics at the solid-solid-liquid trijunction dictate crystalline facet selection. Using the Al-Al 3 Ni alloy as a model, this project combines atomistic simulations and experimental methods to understand interfacial energies and develop predictive models. This approach aims to mitigate the negative effects of intermetallics, enhancing component reliability in electronic applications.

36 MATERIALS SCIENCE↗