Engineering topics

Pratt, J. Richard

Publications and source records attributed to Pratt, J. Richard.

At least 19 records

NASA NTRS1995

Polyimides Made From 3,5-Diaminobenzotrifluoride

Polyimides synthesized from 3,5-diaminobenzotrifluoride (DABTF). One monomer of major importance in preparing these high-temperature polymers is 1,3-phenylenediamine (mPDA). Fluorinated polyimides exhibit characteristics potentially attractive for aerospace and electronic applications. Includes optical transparency, solubility in common polar solvents, enhanced thermo-oxidative stability, low dielectric constants, and high glass-transition temperatures. Polyimides also used to form free-standing films, coatings, and moldings.

St. Clair, Terry L.↗

NASA NTRS1994

Aromatic Polyimides With Low Dielectric Constants

Linear aromatic polyimides developed containing dimethylsilane linkages in dianhydride portions of molecules and at least one trifluoromethyl group in each of diamine portions. Polyimides offer advantages of thermal stability, low density, resistance to ionizing radiation, toughness, flexibility, and exhibit lower dielectric constants. Also polyimides nearly transparent and colorless; an advantage in protective coating of solar photovoltaic cells, optical components, and antennas.

St. Clair, Anne K.↗

NASA NTRS1993

Polyimide processing additives

A process for preparing polyimides having enhanced melt flow properties is described. The process consists of heating a mixture of a high molecular weight poly-(amic acid) or polyimide with a low molecular weight amic acid or imide additive in the range of 0.05 to 15 percent by weight of the additive. The polyimide powders so obtained show improved processability, as evidenced by lower melt viscosity by capillary rheometry. Likewise, films prepared from mixtures of polymers with additives show improved processability with earlier onset of stretching by TMA.

Pratt, J. Richard↗

NASA NTRS1993

Polyimides prepared from 3,5-diamino benzo trifluoride

High performance, thermooxidatively stable polyimides are prepared by reacting aromatic diamines with pendant trifluoromethyl groups and dianhydrides in an amide solvent to form a poly(amic acid), followed by cyclizing the poly(amic acid) to form the corresponding polyimide.

Gerber, Margaret K.↗

NASA NTRS1993

Diphenylmethane-containing dianhydride and polyimides prepared therefrom

A high temperature stable, highly optically transparent-to-colorless, low dielectic linear aromatic polyimide is prepared by reacting an aromatic diamine with 3,3'bis (3,4-dicarboxyphenoxy) diphenylmethane dianhydride in an amide solvent to form a linear aromatic polyamic acid. This polyamic acid is then cyclized to form the corresponding polyimide.

St.clair, Anne K.↗

NASA NTRS1993

Polyimides Made From 4,4'-Isophthaloyldiphthalic Anhydride

High-performance, thermoplastic, amorphous, and semicrystalline materials obtained. In experiments, twelve high-temperature, high-performance polyimide compositions based on 4,4'-isophthaloyldiphthalic anhydride (IDPA) prepared and characterized. Tough, film-forming, polyimides insoluble in organic solvents obtained in most cases. Three materials semicrystalline. Materials offer potential for development of semicrystalline polyimides having enhanced resistances to solvents and caustic chemicals, higher tensile strengths and moduli, enhanced thermo-oxidative stabilities below their melting temperatures, and enhanced melt processability, especially when heated to melting temperatures. Several exhibited excellent long-term thermo-oxidative stability when subjected to isothermal thermogravimetric analysis (ITGA) at temperatures of 300 degrees C and 350 degrees C in air. One area of application, manufacturing of lighter and stronger aircraft and spacecraft structures.

Pratt, J. Richard↗

NASA NTRS1992

Polyimide processing additives

A process for preparing polyimides having enhanced melt flow properties is described. The process consists of heating a mixture of a high molecular weight poly-(amic acid) or polyimide with a low molecular weight amic acid or imide additive in the range of 0.05 to 15 percent by weight of additive. The polyimide powders so obtained show improved processability, as evidenced by lower melt viscosity by capillary rheometry. Likewise, films prepared from mixtures of polymers with additives show improved processability with earlier onset of stretching by TMA.

Fletcher, James C.↗

NASA NTRS1992

Aromatic polyimides containing a dimethylsilane-linked dianhydride

A high-temperature stable, optically transparent, low dielectric aromatic polyimide is prepared by chemically combining equimolar quantities of an aromatic dianhydride reactant and an aromatic diamine reactant, which are selected so that one reactant contains at least one Si(CH.sub.3).sub.2 group in its molecular structure, and the other reactant contains at least one --CH.sub.3 group in its molecular structure. The reactants are chemically combined in a solvent medium to form a solution of a high molecular weight polyamic acid, which is then converted to the corresponding polyimide.

St. Clair, Anne K.↗

NASA NTRS1990

LaRC-I-TPI - A status report on a new high performance, thermoplastic polyimide

A new thermoplastic polyimide designated LaRC-I-TPI has been prepared from 4,4'-isophthaloyldiphthalic anhydride (IDPA) and 1,3-phenylenediamine (m-PDA), phthalic anhydride endcapped or unendcapped. It is closely related to the well-known commercial LaRC-TPI. A survey of the synthesis and some thermal, film, adhesive, fracture toughness, and composite properties of this new polyimide is presented. While both materials have similar properties at comparable stages of development, LaRC-I-TPI should be less expensive to manufacture as a result of the use of lower cost readily available monomers.

Pratt, J. Richard↗

NASA NTRS1990

LARC-I-TPI: A New Thermoplastic Polyimide

"LARC-I-TPI" denotes improved version of LARC-TPI class of thermoplastic polyimides: high-performance polymers developed for manufacture of strong, lightweight aircraft structures. Melt-flow and adhesive properties of new polymers make them attractive for use as matrix resins for composites, molding powders, adhesives, and coating films. Less toxic, improved LARC-I-TPI polymers formulated without 3, 3'-diaminobenzophenone, which is mutagenic and commercially unavailable.

St. Clair, Terry L.↗

NASA NTRS1990

Processable polyimide adhesive and matrix composite resin

A high temperature polyimide composition prepared by reacting 4,4'-isophthaloyldiphthalic anhydride with metaphenylenediamine is employed to prepare matrix resins, adhesives, films, coatings, moldings, and laminates, especially those showing enhanced flow with retention of mechanical and adhesive properties. It can be used in the aerospace industry, for example, in joining metals to metals or metals to composite structures. One area of application is in the manufacture of lighter and stronger aircraft and spacecraft structures.

Pratt, J. Richard↗

NASA NTRS1989

Aromatic polyimides containing a dimethylsilane-linked dianhydride

A high-temperature stable, optically transparent, low dielectric aromatic polyimide is prepared by chemically combining equimolar quantities of an aromatic dianhydride reactant and an aromatic diamine reactant, which are selected so that one reactant contains at least one Si(CH3)2 group in its molecular structure, and the other reactant contains at least one -CF3 group in its molecular structure. The reactants are chemically combined in a solvent medium to form a solution of a high molecular weight polyamic acid, which is then converted to the corresponding polyimide.

St.clair, Anne K.↗

NASA NTRS1989

Novel polyimide compositions based on 4,4': Isophthaloyldiphthalic anaydride (IDPA)

A series of twelve high temperature, high performance polyimide compositions based on 4,4'-isophthaloyl diphthalic anhydride (IDPA) was prepared and characterized. Tough, film-forming, organic solvent-insoluble polyimides were obtained. Three materials were semicrystalline. Several gave excellent long-term thermooxidative stability by isothermal thermogravimetric analysis (ITGA) at 300 C and 350 C in air when compared to Kapton H film (duPont). One extensively studied material displayed different levels of semicrystallinity over a wide range of final cure time/temperatures. The polyimide from IDPA and 1,3-bis (4-aminophenoxy 4'-benzoyl) benzene exhibited multiple crystallization and melting behavior, implying the existence of two kinetic and two thermodynamic crystallization and melting transitions by differential scanning calorimetry (DSC).

Pratt, J. Richard↗

NASA NTRS1989

Additives Lower Pickup Of Moisture By Polyimides

Series of new polyimide-processing additives decrease free volume and pickup of moisture in new 422 copolyimide. Physical properties of several copolyimides synthesized from linear BDSDA/ODA/MPD homopolymers investigated previously, by positron-annihilation spectroscopy, with results indicating copolyimides have unique transition molecular structure characterized by higher electron densities and stronger bonds. Transition structure permits both physical and chemical entry of water molecules into it.

St. Clair, Terry L.↗

NASA NTRS1988

Additives Improve Processing Of Polyimides

Melt-processable polyimides maintain desirable polymer properties prepared by adding small amounts of certain low-molecular-weight, thermally stable additives. Useful in preparing void-free polyimide composites from higher flow resins that wet out fibers at lower processing temperatures. Applied to preparing high-temperature polyimide adhesives allowing enhanced wetting of adherends and ultimately better adhesion. Improvement to processing polyimides and potential application for production of films, coatings, adhesives, and composites.

St. Clair, Terry L.↗

NASA NTRS1988

Thermoplastic adhesives based on 4,4'-isophthaloyldiphthalic anhydride (IDPA)

Thermoplastic polyimides were prepared and evaluated as adhesives. These materials are based on 4,4'-isophthaloyldiphathalic anhydride (IDAP) and either metaphenylene diamine (MPD) or 3,3'-diaminobenzophenone (DBAP). Both polymers exhibit excellent adhesive properties; however, the IDPA-MPD is the more attractive system because of a combination of high mechanical and physical properties as well as being made from commercially attractive monomers. The IDPA-MPD is an isomeric form of the commercially available adhesive and matrix resin, LARC-TPI and both systems have the same glass transition temperature and exhibit similar adhesive properties.

Progar, Donald J.↗

NASA NTRS1988

Isomeric oxydiphthalic anhydride polyimides

Much of the polyimide research at Langley Research Center has focused on isomeric modification of the diamine component; polyimides having considerably improved processability and adhesion have resulted. The present structure-property study was designed to investigate how isomeric attachment of the three oxydiphthalic anhydride (ODPA) polyimides affects their properties. Each dianhydride, 3,4,3',4'-oxydiphthalic anhydride (4,4'-OPDA,I), 2,3,2',3'-oxydiphthalic anhydride (3,3'-ODPA,II), and 2,3,3',4'-oxydiphthalic anhydride (3,4'-OPDA,III), was reacted with p-phenylenediamine, 4,4'-oxydianiline, 3,3'-diaminodiphenylsulfone, 3,3'-diaminobenzophenone, and 4,4'-bis(3-aminophenoxy)benzophenone in DMAc. The inherent viscosities of the resulting poly(amic acids) were determined. Thermally imidized films were studied for their creasability and solubility, as well as by differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and wide angle X-ray scattering (WAXS). A comparison of these properties will be made.

Gerber, Margaret K.↗

NASA NTRS1988

A study of thermal transitions in a new semicrystalline thermoplastic polyimide

A polyimide derive from 4,4'-isophthaloyl diphthalic anhydride (IDPA) and 1,3-bis (4-aminophenoxy 4'-benzoyl) benzene (1,3-BABB) having semicrystalline behavior was prepared and characterized by differential scanning calorimetry (DSC) and wide angle X-ray scattering (WAXS). Thus a poly(amic acid) film cured in air for one hour each at 100 and 200 C displayed an endotherm at 286 C, followed by a crystallization exotherm at 317 C, and a second melting transition at 350 C. The 286 C melting point appeared to result from earlier solvent-induced crystallization. Films cast from DMAc, air dried, and soaked in methylene chloride could not be induced into semicrystallinity. The fully cured polyimide has a Tg of 216 C. Films heated to temperatures as high as 100 C for one hour in air were transparent and light yellow in color. Those films heated to or above 125 C were translucent. Polarized light microscopy revealed the presence of spherulites 608 micrometers in diameter in a sample cured to 275 C in air. Two film samples, one cured to 275 and the other to 325 C, were evaluated for tensile and ultimate strength, modulus, and percent elongation at 25 and 200 C. These values remained essentially constant at each test temperature.

Pratt, J. Richard↗