Search NASA⌕ Search

Engineering topics

Raikar, Subbarao

Publications and source records attributed to Raikar, Subbarao.

Self-terminating etching processes for post-processing of 3D printed metal alloys

A process is provided to remove a selective amount of material from a metal part fabricated by additive manufacturing in a self-terminating manner. The process can be used to remove support structures and trapped powder from a metal part as well as to smooth surfaces of a 3D printed metal part. In one embodiment, selected surfaces of the metal part are treated to make the selected surfaces at least one of mechanically and chemically unstable. The unstable portion of the metal support can then be removed chemically, electrochemically, with a pressure differential, and/or through vapor-phase etching. In one embodiment, the metal part may comprise one or more of an aluminum alloy, a titanium alloy, and a copper alloy. The process can be used to modify any fluid or vapor-accessible regions and surfaces of a 3D printed metal part.

Hildreth, Owen J.↗

Importance of the Heat Treatment Scheme on Self-Reducing Reactive Silver Inks

Self-reducing reactive silver inks can print high-quality silver at reasonable temperatures. While numerous studies have explored the impact of processing temperature on electrical properties, the role of the heat treatment scheme has not yet been studied. Common heat treatment schemes include printing and drying inks at room temperature before heat treatment, performing heat treatments while the inks are still wet, and directly printing the inks onto heated substrates. Each scheme generates distinct heat transfer and mass transport kinetics that can affect the silver morphology and electrical properties. However, to date, the impact of different schemes has not been systematically investigated. To address this knowledge gap, this work investigates how different heat treatment schemes impact metal formation, sintering, and the resultant electrical properties of printed self-reducing reactive silver inks. Heat treatment on room-temperature dried inks and wet inks, with top-down (oven) and bottom-up (hot plate) heating sources, were compared. Inks dried at room temperature resulted in extremely porous films that required high heat treatment temperatures (>100 °C) for silver densification. However, these dried films could only densify locally, and their high initial porosities resulted in voids and high resistances (~0.6 Ω mm –1 ) even after heat treatments above 300 °C. Inks that were wet during heat treatment showed moderate improvements in electrical properties with resistances on the order of 0.4 Ω mm –1 at heat treatments of 250 °C. Printing reactive inks directly onto heated substrates yielded the best low-temperature results, with 0.46 Ω mm –1 (5.5 × bulk silver) line resistances achieved at only 90 °C. Overall, this work’s experimental results provide detailed insights into why printing onto a heated substrate results in superior electrical performance compared to more common heat treatment schemes. Additionally, controlling where the precipitation reaction occurs is critical to controlling the film morphology and properties. As a result, this work shows that even an ammonia-based silver reactive ink can achieve good, low-temperature electrical properties with the proper heat treatment scheme.

14 SOLAR ENERGY↗

Sulfidation kinetics of titanium and Ti-6Al-4V with elemental sulfur

The sulfidation kinetics of titanium and Ti-6Al-4V (Ti64) using elemental sulfur were studied by measuring the amount of metal consumed instead of the change in mass or scale thickness. Here this metal consumption approach combines the parabolic oxidation law, Arrhenius equation, and Pilling-Bedworth ratio to determine the apparent activation energy and the pre-exponential factor of consumption of Ti64 during sulfidation. The estimations of apparent activation energy and pre-exponential factor were 110.4 kJ·mol -1 and 1.3×10 -9 m 2 s -1 for the titanium-sulfur, and 116.2 kJ·mol -1 and 1.2×10 -9 m2s -1 for the Ti64-sulfur system. Finally, a material removal predictor was developed to predict the amount of Ti64 consumed for a given sulfidation temperature and time.

36 MATERIALS SCIENCE↗

Investigation of Reactive Silver Ink Formula for Reduced Silver Consumption in Silicon Heterojunction Metallization

Silver is the most expensive non-silicon component in photovoltaic cells. This is particularly salient for silicon heterojunction (SHJ) cells, which rely on large quantities of low-temperature silver pastes (LT-SP). SHJ cells would benefit greatly from an industrially scalable metallization process that simultaneously offers low silver consumption, low finger resistivities (<20 μΩ·cm), and low processing temperatures. Printed reactive silver inks (RSI) are an innovative candidate to this end. Furthermore, this work furthers the research on RSI metallization by investigating the impact of ink formula on properties pertinent to SHJ cells, including electrical properties, line width, ink splatter, silver consumption, cell performance, and adhesion. We introduce a scalable, high-throughput flexible needle contact printing approach for metallization that solves many of the issues associated with drop-on-demand printing. The printed silver fingers are characterized using electrical measurements and top-down and cross-sectional microscopy. The best performing ink, consisting of silver acetate, ethylamine, and formic acid, achieved silver fingers with total resistivities of 3.1 μΩ·cm and contact resistivities of 3.2 mΩ·cm 2 when printed at 61 °C. This ink metallized a full-sized 156 mm × 156 mm SHJ cell. This is the first reported data for RSI metallization of a full-sized SHJ cell and shows how an optimized RSI can achieve similar performances to LT-SP while consuming 80–90% less silver.

14 SOLAR ENERGY↗

Improving fatigue performance of additively manufactured Ti-6Al-4V using sulfur-based self-terminating etching processes

The adoption of Additively Manufactured (AM) Ti-6Al-4V (Ti64) is continually increasing in the industry due to its benefits over the conventional manufacturing techniques. However, AM Ti64 parts are prone to poor surface finish, which significantly affects their fatigue performance. Therefore, AM Ti64 parts need post-processing to enhance surface finish and fatigue performance. Prior work with a sulfur-based self-terminating etching process for AM Ti64 demonstrated support removal and surface roughness reduction. To further this work, this manuscript details the impact of this sulfur-based post-processing technique on the mechanical properties and the fatigue life of AM Ti64 by characterizing the surface roughness, microstructural evolution, and fracture surfaces. Finally, this post-processing technique decreased the surface roughness parameter - S v by 55 % from 84 ± 11 µm to 38 ± 19 µm and increased the average fatigue life by 340 % from about 7000 cycles to 30,000 cycles.

36 MATERIALS SCIENCE↗