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Reza, Shahed

Publications and source records attributed to Reza, Shahed.

At least 37 records · Page 2

High current density, low contact resistance wide bandgap contacts

A high current density, low contact resistance contact for wide bandgap (WBG) or ultra-wide bandgap materials (UWBG) is disclosed. The contact is lithographically formed so that a total perimeter length of the contact structure is at least twice the length of the side of a contact pad closest to the gate in a high electron mobility transistor (HEMT). The contact structure may take the form of a plurality of columns having various cross-sectional shapes, or may take the form of a convoluted geometrical shape, such as a comb-like, serpentine, or spiral shape. The depth of the contact structure permits direct contact with the two-dimensional electron gas (2DEG) in the HEMT by the perimeter of the contact structure. The contact structure is formed of at least one metal layer, at least one doped material regrown layer, or at least one implanted region. The contact structure may be applied to other WBG and UWBG devices.

36 MATERIALS SCIENCE↗

High-frequency, high-power performance of AlGaN-channel high-electron-mobility transistors: an RF simulation study [High-frequency high power performance of AlGaN channel HEMTs: an RF simulation study]

The emerging Al-rich AlGaN-channel Al x Ga 1–x N/Al y Ga 1–y N high-electron-mobility transistors (HEMTs) with 0.7 ≤ y < x ≤ 1.0 have the potential to greatly exceed the power handling capabilities of today's GaN HEMTs, possibly by five times. This projection is based on the expected 4× enhancement of the critical electric field, the 2× enhancement of sheet carrier density, and the parity of the electron saturation velocity for Al-rich AlGaN-channel HEMTs relative to GaN-channel HEMTs. In this paper, the expected increased RF power density in Al-rich AlGaN-channel HEMTs is calculated by theoretical analysis and computer simulations, based on existing data on long-channel AlGaN devices. It is shown that a saturated power density of 18 W mm –1 , a power-added efficiency of 55% and an output third-order intercept point over 40 dB can be achieved for this technology. Furthermore, the method for large-signal RF performance estimation presented in this paper is generic and can be applied to other novel high-power device technologies at the early stages of development.

42 ENGINEERING↗

Zener Diode Compact Model Parameter Extraction Using Xyce-Dakota Optimization.

This report presents a detailed process for compact model parameter extraction for DC circuit Zener diodes. Following the traditional approach of Zener diode parameter extraction, circuit model representation is defined and then used to capture the different operational regions of a real diode's electrical behavior. The circuit model contains 9 parameters represented by resistors and characteristic diodes as circuit model elements. The process of initial parameter extraction, the identification of parameter values for the circuit model elements, is presented in a way that isolates the dependencies between certain electrical parameters and highlights both the empirical nature of the extraction and portions of the real diode physical behavior which of the parameters are intended to represent. Optimization of the parameters, a necessary part of a robost parameter extraction process, is demonstrated using a 'Xyce-Dakota' workflow, discussed in more detail in the report. Among other realizations during this systematic approach of electrical model parameter extraction, non-physical solutions are possible and can be difficult to avoid because of the interdependencies between the different parameters. The process steps described are fairly general and can be leveraged for other types of semiconductor device model extractions. Also included in the report are recommendations for experiment setups for generating optimum dataset for model extraction and the Parameter Identification and Ranking Table (PIRT) for Zener diodes.

42 ENGINEERING↗