Robinson, Franklin L.

NASA NTRS2019

Gravity Effects in Two-Phase Microgap Flow

The high power density of emerging electronic devices is driving the transition from remote cooling, which relies on conduction and spreading, to embedded cooling, which extracts dissipated heat on-site. Two-phase microgap coolers employ the forced flow of dielectric fluids undergoing phase change in a heated channel within or between devices. Such coolers must work reliably in all orientations for a variety of applications (e.g., vehicle-based equipment), as well as in microgravity and high-g for aerospace applications, but the lack of acceptable models and correlations for orientation- and gravity-independent operation has limited their use. Reliable criteria for achieving orientation- and gravity-independent flow boiling would enable emerging systems to exploit this thermal management technique and streamline the technology development process. As a first step toward understanding the effect of gravity in two-phase microgap flow and transport, in an earlier effort, the authors studied the effects of evaporator orientation, mass flux, and heat flux on flow boiling of HFE7100 in a 1.01 mm tall by 13.0 mm wide by 12.7 mm long microgap channel. Orientation-independence, defined as achieving similar critical heat fluxes, heat transfer coefficients, and flow regimes across orientations, was achieved for mass fluxes of 400 kg/sq.m-s and greater (corresponding to a Froude number of about 0.8). In the present effort, the authors have studied the effects of gravity, mass flux, and subcooling on flow boiling of HFE7100 in a 0.17 mm tall by 13.0 mm wide by 12.7 mm long microgap channel. The Flow Boiling in Microgap Coolers payload experienced about three minutes of weightlessness and shorter periods of high-g (up to about 5 g) during two recent flights aboard the Blue Origin New Shepard reusable launch vehicle. The results from the flight experiments will be presented and compared with published criteria for achieving gravity-independence.

Robinson, Franklin L.↗

NASA NTRS2018

Orientation Effects in Two-Phase Microgap Flow

The high power density of emerging electronic devices is driving the transition from remote cooling, which relies onconduction and spreading, to embedded cooling, which extracts dissipated heat on-site. Two-phase microgap coolersemploy the forced flow of dielectric fluids undergoing phase change in a heated channel within or between devices. Such coolers must work reliably in all orientations for a variety of applications (e.g., vehicle-based equipment), as well as in microgravity and high-g for other applications (e.g., spacecraft and aircraft). The lack of acceptable models andcorrelations for orientation- and gravity-independent operation has limited the use of two-phase coolers in suchapplications. Previous research has revealed that gravitational acceleration plays a diminishing role in establishing flow regimes and transport rates as the channel size shrinks, but there is considerable variation among the proposed microscale criteria and limited research on two-phase flows in low aspect ratio microgap channels. Reliable criteria for achieving orientation- and gravity-independent flow boiling would enable emerging systems to exploit this thermal management technique and streamline the technology development process.

orientation↗

NASA NTRS2018

Orientation Effects in Two-Phase Microgap Flow

The high power density of emerging electronic devices is driving the transition from remote cooling, which relies on con-duction and spreading, to embedded cooling, which extracts dissipated heat on-site. Two-phase microgap coolers employ the forced flow of dielectric fluids undergoing phase change in a heated channel within or between devices. Such coolers must work reliably in all orientations for a variety of applications (e.g., vehicle-based equipment), as well as in microgravity and high-g for other applications (e.g., spacecraft and aircraft). The lack of acceptable models and correlations for orientation- and gravity-independent operation has limited the use of two-phase coolers in such applications. Previous research has revealed that gravita-tional acceleration plays a diminishing role in establishing flow regimes and transport rates as the channel size shrinks, but there is considerable variation among the proposed microscale criteria and limited research on two-phase flows in low aspect ratio mi-crogap channels. Reliable criteria for achieving orientation- and gravity-independent flow boiling would enable emerging sys-tems to exploit this thermal management technique and streamline the technology development process. As a first step toward understanding the effect of gravity on two-phase microgap flow and transport, in the present effort the authors have studied the effect of evaporator orientation and mass flux on near-saturated flow boiling of HFE7100 in a 1.01 mm tall by 13.0 mm wide by 12.7 mm long microgap channel. Orientation-independence, defined as achieving similar critical heat fluxes, heat transfer coefficients, and flow regimes across evaporator orientations, was achieved for mass fluxes of 400 kg/m2-s and greater. The present results are compared to pub-lished criteria for achieving gravity-independence.

orientation↗

NASA NTRS2018

Challenges and Opportunities in Gen3 Embedded Cooling with High-Quality Microgap Flow

Gen3, Embedded Cooling, promises to revolutionize thermal management of advanced microelectronic systems by eliminating the sequential conductive and interfacial thermal resistances which dominate the present 'remote cooling' paradigm. Single-phase interchip microfluidic flow with high thermal conductivity chips and substrates has been used successfully to cool single transistors dissipating more than 40kW/sq cm, but efficient heat removal from transistor arrays, larger chips, and chip stacks operating at these prodigious heat fluxes would require the use of high vapor fraction (quality), two-phase cooling in intra- and inter-chip microgap channels. The motivation, as well as the challenges and opportunities associated with evaporative embedded cooling in realistic form factors, is the focus of this paper. The paper will begin with a brief review of the history of thermal packaging, reflecting the 70-year 'inward migration' of cooling technology from the computer-room, to the rack, and then to the single chip and multichip module with 'remote' or attached air- and liquid-cooled coldplates. Discussion of the limitations of this approach and recent results from single-phase embedded cooling will follow. This will set the stage for discussion of the development challenges associated with application of this Gen3 thermal management paradigm to commercial semiconductor hardware, including dealing with the effects of channel length, orientation, and manifold-driven centrifugal acceleration on the governing behavior.

microchannel↗